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Agnesina, Anthony
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1

Challenges for Automating PCB Layout:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Liu, Wen-Hao ; Agnesina, Anthony ; Ren, Haoxing Mark - p. 91-92 , 2024
Link: https://dl.acm.org/doi/1..
 
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2

MedPart: A Multi-Level Evolutionary Differentiable Hypergra..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Liang, Rongjian ; Agnesina, Anthony ; Ren, Haoxing - p. 3-11 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

Huang, Yen-Hsiang ; Pentapati, Sai ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  , 2024
Link: https://doi.org/10.1109/..
 
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4

Hier-3D: A Methodology for Physical Hierarchy Exploration o..:

Bethur, Nesara Eranna ; Agnesina, Anthony ; Brunion, Moritz...
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  43 (2024)  7 - p. 1957-1970 , 2024
Link: https://doi.org/10.1109/..
 
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5

GPU/ML-Enhanced Large Scale Global Routing Contest:

, In: Proceedings of the 2024 International Symposium on Physical Design,
Liang, Rongjian ; Agnesina, Anthony ; Liu, Wen-Hao. - p. 269-274 , 2024
Link: https://dl.acm.org/doi/1..
 
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6

A PPA Study of Reinforced Placement Parameter Autotuning: P..:

Murali, Gauthaman ; Agnesina, Anthony ; Lim, Sung Kyu
ACM Transactions on Design Automation of Electronic Systems.  28 (2023)  5 - p. 1-22 , 2023
Link: https://doi.org/10.1145/..
 
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7

Invited Paper: CircuitOps: An ML Infrastructure Enabling Ge..:

, In: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD),
Liang, Rongjian ; Agnesina, Anthony ; Pradipta, Geraldo.. - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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8

AutoDMP : Automated DREAMPlace-based Macro Placement:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Agnesina, Anthony ; Rajvanshi, Puranjay ; Yang, Tian... - p. 149-157 , 2023
Link: https://dl.acm.org/doi/1..
 
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9

Parameter Optimization of VLSI Placement Through Deep Reinf..:

Agnesina, Anthony ; Chang, Kyungwook ; Lim, Sung Kyu
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  42 (2023)  4 - p. 1295-1308 , 2023
Link: https://doi.org/10.1109/..
 
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10

On Legalization of Die Bonding Bumps and Pads for 3D ICs:

, In: Proceedings of the 2023 International Symposium on Physical Design,
Pentapati, Sai ; Agnesina, Anthony ; Brunion, Moritz.. - p. 62-70 , 2023
Link: https://dl.acm.org/doi/1..
 
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11

Power, Performance, Area, and Cost Analysis of Face-to-Face..:

Agnesina, Anthony ; Brunion, Moritz ; Kim, Jinwoo...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  3 - p. 300-314 , 2023
Link: https://doi.org/10.1109/..
 
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12

A Clock Tree Prediction and Optimization Framework Using Ge..:

Lu, Yi-Chen ; Lee, Jeehyun ; Agnesina, Anthony..
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.  41 (2022)  9 - p. 3104-3117 , 2022
Link: https://doi.org/10.1109/..
 
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13

ART-3D: Analytical 3D Placement with Reinforced Parameter T..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Murali, Gauthaman ; Shaji, Sandra Maria ; Agnesina, Anthony.. - p. 97-104 , 2022
Link: https://dl.acm.org/doi/1..
 
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14

Hier-3D: A Hierarchical Physical Design Methodology for Fac..:

, In: Proceedings of the ACM/IEEE International Symposium on Low Power Electronics and Design,
Agnesina, Anthony ; Brunion, Moritz ; Garcia-Ortiz, Alberto... - p. 1-6 , 2022
Link: https://dl.acm.org/doi/1..
 
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15

Circuit Optimization for 2D and 3D ICs with Machine Learnin:

, In: Machine Learning Applications in Electronic Design Automation,
Agnesina, Anthony ; Lu, Yi-Chen ; Lim, Sung Kyu - p. 247-275 , 2022
Link: https://doi.org/10.1007/..
 
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