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Agyakwa, Pearl A.
24  results:
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1

Microstructural Response of Highly Porous Sintered Nano-sil..:

Agyakwa, Pearl A. ; Robertson, Stuart ; Dai, Jingru...
Journal of Electronic Materials.  53 (2024)  3 - p. 1374-1398 , 2024
Link: https://doi.org/10.1007/..
 
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2

Self-assembled titanium-based macrostructures with hierarch..:

Wadge, Matthew D. ; Agyakwa, Pearl A. ; Felfel, Reda M....
Materials & Design.  240 (2024)  - p. 112835 , 2024
Link: https://doi.org/10.1016/..
 
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3

Shear strength of die attachments prepared using dry nanosi..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl..
Microelectronics Reliability.  111 (2020)  - p. 113740 , 2020
Link: https://doi.org/10.1016/..
 
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4

Packaging degradation studies of High Temperature SiC MOSFE..:

, In: 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Mouawad, Bassem ; Yang, Li ; Agyakwa, Pearl.. - p. 90-93 , 2020
Link: https://doi.org/10.1109/..
 
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5

Predicting Lifetime of Thick Al Wire Bonds Using Signals Ob..:

Arjmand, Elaheh ; Agyakwa, Pearl A. ; Corfield, Martin R...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  6 (2016)  5 - p. 814-821 , 2016
Link: https://doi.org/10.1109/..
 
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6

Damage Evolution in Al Wire Bonds Subjected to a Junction T..:

Agyakwa, Pearl A. ; Yang, Li ; Arjmand, Elaheh...
Journal of Electronic Materials.  45 (2016)  7 - p. 3659-3672 , 2016
Link: https://doi.org/10.1007/..
 
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7

Quantification of cracked area in thermal path of high-powe..:

Eleffendi, Mohd. Amir ; Yang, Li ; Agyakwa, Pearl.
Microelectronics Reliability.  59 (2016)  - p. 73-83 , 2016
Link: https://doi.org/10.1016/..
 
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8

A thermal cycling reliability study of ultrasonically bonde..:

Arjmand, Elaheh ; Agyakwa, Pearl A. ; Corfield, Martin R....
Microelectronics Reliability.  59 (2016)  - p. 126-133 , 2016
Link: https://doi.org/10.1016/..
 
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9

Quantitative Microstructure Characterization of Ag Nanopart..:

Wang, Yun ; Li, Jianfeng ; Agyakwa, Pearl..
Molecular Crystals and Liquid Crystals.  604 (2014)  1 - p. 11-26 , 2014
Link: https://doi.org/10.1080/..
 
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10

Reliability and Characterization of Nanosilver Joints Prepa..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl..
https://nottingham-repository.worktribe.com/output/6681744.  , 2021
Link: https://doi.org/10.1109/..
 
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11

Shear strength of die attachments prepared using dry nanosi..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl..
https://nottingham-repository.worktribe.com/output/4766899.  , 2020
Link: https://doi.org/10.1016/..
 
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12

Comparative Thermal and Structural Characterization of Sint..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl..
https://nottingham-repository.worktribe.com/output/923275.  , 2018
Link: https://doi.org/10.1109/..
 
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13

Time-efficient sintering processes to attach power devices ..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl.
https://nottingham-repository.worktribe.com/output/17665132.  , 2017
Link: https://doi.org/10.4071/..
 
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14

Time-Efficient Sintering Processes to Attach Power Devices ..:

Dai, Jingru ; Li, Jianfeng ; Agyakwa, Pearl.
https://nottingham-repository.worktribe.com/output/890412.  , 2017
Link: https://doi.org/10.4071/..
 
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15

A thermal cycling reliability study of ultrasonically bonde..:

Arjmand, Elaheh ; Agyakwa, Pearl A ; Corfield, Martin R...
https://nottingham-repository.worktribe.com/output/977208.  , 2016
Link: https://doi.org/10.1016/..
 
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