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1

Effect of Underfill on Substrate Trace Crack under PTC:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Yu, Wei ; Pan, Ling ; Aik Boo, Kelvin Tan... - p. 678-682 , 2023

Link: https://doi.org/10.1109/..

2

Design Optimization to Boost Solder Joint Reliability Perfo..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),

Pan, Ling ; Che, Fa Xing ; Yu, Wei... - p. 674-677 , 2023

Link: https://doi.org/10.1109/..

3

Tu1464 Retrospective Cohort Study of the Clinical Outcome o..:

Tan, Aik Khien Victor ; Wang, Yu Tien ; Ng, Doris...
Gastroenterology. 148 (2015) 4 - p. S-899 , 2015

Link: https://doi.org/10.1016/..

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