Al-Haidari, Riadh
64  results:
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1

Impact of Covid-19 Pandemic on Demand and Demand Forecastin..:

, In: Lecture Notes in Management and Industrial Engineering; Industrial Engineering in the Sustainability Era,
 
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2

Novel SiO2 Cables With Edge Launch Connectors for High Temp..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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3

Embedded RF Packaging Via Ceramic 3D Printing and Printed E..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Obeidat, Abdullah S. ; Umar, Ashraf ; Dou, Zhi... - p. 685-692 , 2024
 
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4

Conformal Dry Electrode for ECG Monitoring:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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5

Evaluation of Materials for the Design and Development of S..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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7

Direct-Write NiO RRAM Cells:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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9

Effect of Thermal & Mechanical Stresses on Novel Microstrip..:

Obeidat, Abdullah S. ; Enkerakpo, Emuobosan ; Umar, Ashraf...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
 
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10

Passive UHF-RFID Tag With Printed Security Features for Aut..:

Enakerakpo, Emuobosan ; Umar, Ashraf ; Alhendi, Mohammed...
IEEE Journal of Radio Frequency Identification.  8 (2024)  - p. 49-57 , 2024
 
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11

Development of a Reusable Smart-Catheter System for Improve..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Dou, Zhi ; Al-Shaibani, WT ; Diaz, Erika Solano... - p. 2117-2124 , 2024
 
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12

Performance Evaluation of RF Novel Microstrip Lines Printed..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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13

Electromechanical and Thermal Characterization of Printed L..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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14

Evaluation of Electromechanical Performance of A Flexible H..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Dou, Zhi ; Richmond, Dylan ; Schadt, Mark... - p. 2213-2217 , 2023
 
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15

Planar SiC Power Module Packaging and Interconnections Usin..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
 
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