E-LIB Suche - Ergebnisse für: Alahmer, Mohamed

1

Prelacrimal Recess Approach in Unilateral Maxillary Sinus L..:

Abdulla, Mohamed ; Refaat, Osama ; Alahmer, Mohamed...
Medicina. 60 (2024) 2 - p. 222 , 2024

Link: https://doi.org/10.3390/..

2

Alterations in Inflammatory Markers and Cognitive Ability a..:

Eldin, Mohamed Shams ; Alahmer, Mohamed ; Alkashlan, Ebrahim...
Medicina. 59 (2023) 2 - p. 204 , 2023

Link: https://doi.org/10.3390/..

3

Alterations in Inflammatory Markers and Cognitive Ability a..:

Eldin, Mohamed Shams ; Alahmer, Mohamed ; Alkashlan, Ebrahim...
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968190/. , 2023

Link: http://www.ncbi.nlm.nih...

4

Alterations in Inflammatory Markers and Cognitive Ability a..:

Mohamed Shams Eldin ; Mohamed Alahmer ; Ebrahim Alkashlan...
https://www.mdpi.com/1648-9144/59/2/204. , 2023

Link: https://doi.org/10.3390/..

5

Alterations in Inflammatory Markers and Cognitive Ability a..:

Mohamed Shams Eldin ; Mohamed Alahmer ; Ebrahim Alkashlan...
Pulmonary. , 2023

Link: https://doi.org/10.3390/..

6

Combined Endoscopic Sinus Surgery and Eustachian Tube Ballo..:

Mohamed Alahmer ; Ashraf Wahba
https://ijma.journals.ekb.eg/article_129166_71388245aad1557e6f4fe61c8e6c9373.pdf. , 2021

Link: https://doi.org/10.21608..

7

Comparative Drop Shock Reliability Study of SAC-Based Alloy..:

Vyas, Palash Pranav ; Alahmer, Ali ; Alavi, Seyed Soroosh..
IEEE Transactions on Components, Packaging and Manufacturing Technology. 14 (2024) 3 - p. 406-416 , 2024

Link: https://doi.org/10.1109/..

8

Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Va..:

Jian, Minghong ; Hamasha, Sa'd ; Alahmer, Ali...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 2 - p. 274-283 , 2023

Link: https://doi.org/10.1109/..

9

The Impact of Bi Content on the Coarsening Kinetics of IMC ..:

Belhadi, Mohamed El Amine ; Hamasha, Sa'd ; Alahmer, Ali...
Journal of Electronic Materials. , 2023

Link: https://doi.org/10.1007/..

10

Investigating the Evolution of Creep Properties During Ther..:

Belhadi, Mohamed El Amine ; Hamasha, Sa'd ; Alahmer, Ali...
IEEE Transactions on Components, Packaging and Manufacturing Technology. 13 (2023) 12 - p. 1951-1965 , 2023

Link: https://doi.org/10.1109/..

11

Fatigue performance and microstructure of lead-free solder ..:

Wei, Xin ; Hamasha, Sa'd ; Alahmer, Ali..
Microelectronics Reliability. 149 (2023) - p. 115217 , 2023

Link: https://doi.org/10.1016/..

12

Effect of Solder Paste Alloy and Volume on Solder Voiding:

, In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),

Alakayleh, Abdallah ; El Amine Belhadi, Mohamed ; Tahat, Sufyan... - p. 1-8 , 2023

Link: https://doi.org/10.1109/..

13

Effect of Bi content and aging on solder joint shear proper..:

Belhadi, Mohamed El Amine ; Hamasha, Sa'd ; Alahmer, Ali
Microelectronics Reliability. 146 (2023) - p. 115020 , 2023

Link: https://doi.org/10.1016/..

14

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjecte..:

Jian, Minghong ; Hamasha, Sa'd ; Alahmer, Ali...
Materials. 16 (2023) 2 - p. 750 , 2023

Link: https://doi.org/10.3390/..

15

The Effect of Micro-Alloying and Surface Finishes on the Th..:

Akkara, Francy John ; Hamasha, Sa'd ; Alahmer, Ali...
Materials. 15 (2022) 19 - p. 6759 , 2022

Link: https://doi.org/10.3390/..