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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
1
A 24.6-29.6GHz Hybrid Sub-Sampling PLL with Tri-State Integ..:
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2024 37th International Conference on VLSI Design and 2024 23rd International Conference on Embedded Systems (VLSID) ,
2
Power Integrity Analysis for Interoperability of BoW Chiple..:
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2022 IEEE International Symposium on Circuits and Systems (ISCAS) ,
5
A Ring-Oscillator Sub-Sampling PLL With Hybrid Loop Using G..:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
6
A D-Band Packaged CMOS Integrated Transmitter for MU-MIMO A..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
9
A 200Gb/s PAM-4 Transmitter with Hybrid Sub-Sampling PLL in..:
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Integrated Circuits and Systems; The Fourth Terminal ,
10
System Integration of RISC-V Processors with FD-SOI:
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2020 21st International Symposium on Quality Electronic Design (ISQED) ,
11
A Methodology for Reusable Physical Design:
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2020 IEEE Custom Integrated Circuits Conference (CICC) ,
12
A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GH..:
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2020 IEEE International Conference on Communications Workshops (ICC Workshops) ,
14
Design and Demonstration of a Scalable Massive MIMO Uplink ..:
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2019 International SoC Design Conference (ISOCC) ,
15