E-LIB Suche - Ergebnisse für: Amalu, Emeka H.

1

Critical solder joint in insulated gate bipolar transistors..:

Nebo, Sunday E. ; Amalu, Emeka H. ; Hughes, David J.
Microelectronic Engineering. 291 (2024) - p. 112200 , 2024

Link: https://doi.org/10.1016/..

2

Effect of Creep, Fatigue and Random Vibration on the Integr..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Microelectronics Reliability. 157 (2024) - p. 115415 , 2024

Link: https://doi.org/10.1016/..

3

Critical methods of geopolymer feedstocks activation for su..:

Kehinde, Oluyemi ; Hughes, David J. ; Amalu, Emeka H.
Heliyon. 10 (2024) 9 - p. e29771 , 2024

Link: https://doi.org/10.1016/..

4

Effects of Reflow Profile and Miniaturisation on the Integr..:

Njoku, Jude E. ; Amalu, Emeka H. ; Ekere, Ndy...
Journal of Electronic Materials. 52 (2023) 6 - p. 3786-3796 , 2023

Link: https://doi.org/10.1007/..

5

Characterising Solder Materials from Random Vibration Respo..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Journal of Electronic Materials. , 2023

Link: https://doi.org/10.1007/..

6

Critical skills needs and challenges for STEM/STEAM graduat..:

Amalu, Emeka H. ; Short, Michael ; Chong, Perk Lin...
Renewable and Sustainable Energy Reviews. 187 (2023) - p. 113776 , 2023

Link: https://doi.org/10.1016/..

7

Thermal control of crystalline silicon photovoltaic (c-Si P..:

Amalu, Emeka H. ; Fabunmi, Oluwagbemiga A.
Solar Energy. 234 (2022) - p. 203-221 , 2022

Link: https://doi.org/10.1016/..

8

A review of technology, materials and R&D challenges of upp..:

Brack, Robbie ; Amalu, Emeka H.
Journal of Orthopaedics. 23 (2021) - p. 88-96 , 2021

Link: https://doi.org/10.1016/..

9

Thermal fatigue life of ball grid array (BGA) solder joints..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Engineering Failure Analysis. 125 (2021) - p. 105447 , 2021

Link: https://doi.org/10.1016/..

10

Effective Solder for Improved Thermo-Mechanical Reliability..:

Depiver, Joshua A. ; Mallik, Sabuj ; Amalu, Emeka H.
Journal of Electronic Materials. 50 (2020) 1 - p. 263-282 , 2020

Link: https://doi.org/10.1007/..

11

Comparing and Benchmarking Fatigue Behaviours of Various SA..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),

Adeniyi Depiver, Joshua ; Mallik, Sabuj ; Amalu, Emeka H. - p. 1-11 , 2020

Link: https://doi.org/10.1109/..

12

Robust crystalline silicon photovoltaic module (c-Si PVM) f..:

Nyarko, Frank K.A. ; Takyi, G. ; Amalu, Emeka H.
Scientific African. 8 (2020) - p. e00359 , 2020

Link: https://doi.org/10.1016/..

13

Generating temperature cycle profile from in-situ climatic ..:

Nyarko, Frank K.A. ; Takyi, G. ; Amalu, Emeka H..
Engineering Science and Technology, an International Journal. 22 (2019) 2 - p. 502-514 , 2019

Link: https://doi.org/10.1016/..

14

Creep Damage of BGA Solder Interconnects Subjected to Therm..:

, In: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC),

Depiver, Joshua A. ; Mallik, Sabuj ; Harmanto, Dani. - p. 143-153 , 2019

Link: https://doi.org/10.1109/..

15

Effect of operating temperature on degradation of solder jo..:

Ogbomo, Osarumen O. ; Amalu, Emeka H. ; Ekere, N.N..
Solar Energy. 170 (2018) - p. 682-693 , 2018

Link: https://doi.org/10.1016/..