Ambat, Rajan
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2

Study of Interaction Between Reflow Solder Flux and Humidit..:

Lakkaraju, Anish Rao ; Conseil-Gudla, Helene ; Ambat, Rajan
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  3 - p. 510-518 , 2024
 
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6

Probability of Failure due to Electrochemical Migration on ..:

, In: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),
Bahrebar, Sajjad ; Ambat, Rajan - p. 1-9 , 2023
 
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7

Effect of flux activator in reflow process related flux res..:

Li, Feng ; Lakkaraju, Anish Rao ; Jellesen, Morten Stendahl.
Journal of Materials Science: Materials in Electronics.  34 (2023)  16 - p. , 2023
 
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9

Electrochemical and molecular modelling studies of corrosio..:

Gupta, Shivangi ; Yazdi, Rouhollah ; Andersson, Martin.
Corrosion Engineering, Science and Technology.  58 (2023)  6 - p. 537-548 , 2023
 
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15

Time to Failure Prediction on a Printed Circuit Board Surfa..:

Bahrebar, Sajjad ; Ambat, Rajan
Journal of Electronic Materials.  51 (2022)  8 - p. 4388-4406 , 2022
 
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