Bachok, Zuraihana
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3

Structural Analysis of Silver-Based Conductive Ink Under Cy..:

, In: Springer Proceedings in Physics; Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium,
 
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Characterization of SAC – x NiO nano-reinforced lead-free s..:

Che Ani, Fakhrozi ; Jalar, Azman ; Saad, Abdullah Aziz...
Soldering & Surface Mount Technology.  31 (2019)  2 - p. 109-124 , 2019
 
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Structural Analysis and Material Characterization of Silver..:

Zulfiqar, Sana ; Saad, Abdullah Aziz ; Ahmad, Zulkifli..
http://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/9536/4498.  , 2021
 
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Structural Assessment of Lead Free Solder Joint of Miniatur..:

Saad, Abdullah Aziz ; Bachok, Zuraihana ; Che Ani, Fakhrozi..
http://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/2548/1691.  , 2018
 
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