Baciu, Florin
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12

Measurement of some properties for material qualification i..:

, In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME),
 
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14

Investigations on the Robustness of a Solderless Assembled ..:

, In: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC),
 
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