Bae, Jaehun
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4

Wafer Level Void-Free Molded Underfill for High-Density Fan..:

, In: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC),
Mok, InSu ; Bae, JaeHun ; Ki, WonMyoung... - p. 419-424 , 2020
 
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5

Heterogeneous Integration Using Organic Interposer Technolo..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Scott, George J. ; Bae, JaeHun ; Yang, KiYeul... - p. 885-892 , 2020
 
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6

Purification and characterization of turanose, a sucrose is..:

Kim, Eunju ; Bae, Jaehun ; Lee, Jihye...
Journal of Functional Foods.  63 (2019)  - p. 103570 , 2019
 
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8

Purification and characterization of turanose, a sucrose is..:

Eunju Kim ; Jaehun Bae ; Jihye Lee...
http://www.sciencedirect.com/science/article/pii/S1756464619304943.  , 2019
 
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9

TiO2 treatment using ultrasonication for bubble cavitation ..:

Jae-hun Bae ; Seong-bin Do ; Sung-ho Cho...
http://www.sciencedirect.com/science/article/pii/S1350417722000268.  , 2022
 
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13

Comparison of Weldability and Microstructure in Resistance ..:

Jun, Hyun-Uk ; Kim, Jaehun ; Kim, Wonho...
Korean Journal of Metals and Materials.  62 (2024)  1 - p. 1-11 , 2024
 
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14

2.4 ATOMUS: A 5nm 32TFLOPS/128TOPS ML System-on-Chip for La..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Yu, Chang-Hyo ; Kim, Hyo-Eun ; Shin, Sungho... - p. 42-44 , 2024
 
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