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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Finite Element Modeling for Wafer-to-Wafer Direct Bonding B..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
Chip level evaluation of wafer-to-wafer direct bonding stre..:
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2023 IEEE International Symposium on Circuits and Systems (ISCAS) ,
6
A 48-Gb/s Single-Ended PAM-4 Receiver with Adaptive Nonline..:
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2023 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
7
A PAM4 Level Mismatch Adjustment Scheme for 48-Gb/s PAM4 Me..:
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2022 19th International SoC Design Conference (ISOCC) ,
13