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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
4
Completely Filling of Through-Silicon-Vias with High Aspect..:
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2022 China Semiconductor Technology International Conference (CSTIC) ,
5
Low - Temperature Die to Glass Wafer Bonding Based on Au-Au..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
6
Enhancement of inductance and quality factor of solenoid in..:
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2022 7th International Conference on Integrated Circuits and Microsystems (ICICM) ,
7
Study on Warpage of Interposer by Chip Distribution:
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Proceedings of the 11th ACM International Conference on Underwater Networks & Systems ,
14