Bardelli, Roberto
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Novel Methodology for Assessing Chip-Package Interaction Ef..:

, In: Proceedings of the 2022 International Symposium on Physical Design,
Kteyan, Armen ; Choy, Jun-Ho ; Sukharev, Valeriy... - p. 83-89 , 2022
 
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A 256-Element Spiral CMUT Array with Integrated Analog Fron..:

, In: 2018 IEEE International Ultrasonics Symposium (IUS),
 
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