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Beyer, Gerald
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1

Multi-tier die stacking through collective die-to-wafer hyb..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Lin, Ye ; Suhard, Samuel... - p. 637-642 , 2024
Link: https://doi.org/10.1109/..
 
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2

Scaling Cu/SiCN Wafer-to-Wafer Hybrid Bonding down to 400 n..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Zhang, Boyao ; Chew, Soon-Aik ; Stucchi, Michele... - p. 312-318 , 2024
Link: https://doi.org/10.1109/..
 
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3

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Dangol, Anish ; Hussain, Tassawar... - p. 821-828 , 2024
Link: https://doi.org/10.1109/..
 
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4

Investigation of Distortion in Wafer-to-wafer Bonding with ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Kang, Shuo ; Iacovo, Serena ; D'have, Koen... - p. 386-393 , 2024
Link: https://doi.org/10.1109/..
 
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5

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
Link: https://doi.org/10.1109/..
 
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6

NATO Expansion after 1989: An Argument from the Catholic So..:

Beyer, Gerald J.
Theological Studies.  85 (2024)  1 - p. 162-189 , 2024
Link: https://doi.org/10.1177/..
 
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7

The Challenges and Solutions of Cu/SiCN Wafer-to-Wafer Hybr..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chew, Soon-Aik ; Zhang, Boyao ; Vanstreels, Kris... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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8

Detection of bonding voids in multi-tier stacks with scanni..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Chen, Cong ; Slabbekoorn, John ; Bogdanowicz, Janusz... - p. 320-325 , 2023
Link: https://doi.org/10.1109/..
 
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9

New Cu "Bulge-Out" Mechanism Supporting SubMicron Scaling o..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
De Messemaeker, Joke ; Witters, Liesbeth ; Zhang, Boyao... - p. 109-113 , 2023
Link: https://doi.org/10.1109/..
 
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10

Process Challenges During CVD Oxide Deposition on the Backs..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kennes, Koen ; Guerrero, Alice ; Salahouelhadj, Abdellah... - p. 1584-1589 , 2023
Link: https://doi.org/10.1109/..
 
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11

A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Iacovo, Serena ; D'have, Koen ; Okudur, Oguzhan Orkut... - p. 1410-1417 , 2023
Link: https://doi.org/10.1109/..
 
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12

Nano-Through Silicon Vias (nTSV) for Backside Power Deliver..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Beyne, Eric ; Jourdain, Anne ; Beyer, Gerald - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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13

Integration of plasma dicing in the collective die to wafer..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Suhard, Samuel ; Kennes, Koen ; Bex, Pieter... - p. 144-149 , 2023
Link: https://doi.org/10.1109/..
 
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14

700nm pitch Cu/SiCN wafer-to-wafer hybrid bonding:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chew, Soon-Aik ; Iacovo, Serena ; Fordor, Ferenc... - p. 334-337 , 2022
Link: https://doi.org/10.1109/..
 
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15

Buried Power Rails and Nano-Scale TSV: Technology Boosters ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Jourdain, Anne ; Stucchi, Michele ; Van der Plas, Geert.. - p. 1531-1538 , 2022
Link: https://doi.org/10.1109/..
 
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