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Bie, Xiaorui
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1

JMEMS Letters.1pt Characterization of a Temperature-Sensiti..:

Zhang, Jingyi ; Lyu, Haoqi ; Yang, Wuhao...
Journal of Microelectromechanical Systems.  , 2024
Link: https://doi.org/10.1109/..
 
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2

A 7.25 μ K Ultrahigh Resolution MEMS Resonant Thermometer:

Wang, Zheng ; Ma, Liangbo ; Bie, Xiaorui...
IEEE Sensors Journal.  24 (2024)  8 - p. 12161-12168 , 2024
Link: https://doi.org/10.1109/..
 
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3

Enhancing Sensitivity of Mode-Localized Accelerometers Usin..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Wang, Zheng ; Xiong, XingYin ; Wang, KunFeng... - p. 907-910 , 2024
Link: https://doi.org/10.1109/..
 
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4

Bridging Piezoelectric And Electrostatic Effects:A Novel Pi..:

, In: 2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL),
Qi, Zhenxiang ; Zhai, Zhaoyang ; Wang, Bowen... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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5

A decouple-decomposition noise analysis model for closed-lo..:

Wang, Kunfeng ; Xiong, XingYin ; Wang, Zheng...
Microsystems & Nanoengineering.  9 (2023)  1 - p. , 2023
Link: https://doi.org/10.1038/..
 
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6

Analysis of the Thermally Induced Packaging Effects on the ..:

Bie, Xiaorui ; Xiong, Xingyin ; Wang, Zheng...
Micromachines.  14 (2023)  8 - p. 1556 , 2023
Link: https://doi.org/10.3390/..
 
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7

Enhancing sensitivity in mode-localized tilt sensors based ..:

Wang, Zheng ; Xiong, Xingyin ; Wang, Kunfeng...
Journal of Physics: Conference Series.  2591 (2023)  1 - p. 012023 , 2023
Link: https://doi.org/10.1088/..
 
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8

A graph optimization approach to range-based relative locat..:

Li, Zhitian ; Zhao, Nan ; Xiong, Xingyin...
Journal of Physics: Conference Series.  2591 (2023)  1 - p. 012018 , 2023
Link: https://doi.org/10.1088/..
 
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9

Numerical simulation of the wire bonding reliability of IGB..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Bie, Xiaorui ; Qin, Fei ; An, Tong.. - p. 1396-1401 , 2017
Link: https://doi.org/10.1109/..
 
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10

Electro-thermal and thermal-mechanical FE analysis of IGBT ..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Zhao, Jingyi ; Qin, Fei ; An, Tong.. - p. 548-551 , 2017
Link: https://doi.org/10.1109/..
 
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11

Study on temperature distribution of IGBT module:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Fang, Chao ; An, Tong ; Qin, Fei.. - p. 1314-1318 , 2017
Link: https://doi.org/10.1109/..
 
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12

Copper pillar bump design optimization based on Taguchi met..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Shi, Ge ; Bie, Xiaorui ; An, Tong. - p. 1108-1111 , 2016
Link: https://doi.org/10.1109/..
 
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13

Impacts of back-grinding process parameters on the strength..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Bie, Xiaorui ; Qin, Fei ; Zhou, Linfeng... - p. 1197-1200 , 2016
Link: https://doi.org/10.1109/..
 
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14

Thermal fatigue reliability analysis of PBGA with Sn63Pb37 ..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Li, Huaicheng ; An, Tong ; Bie, Xiaorui.. - p. 1104-1107 , 2016
Link: https://doi.org/10.1109/..
 
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15

Optimal design of the stress-buffering structure in MEMS re..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Xiaorui, Bie ; Xingyin, Xiong ; Zheng, Wang... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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