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2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
1
Kirkendall Voids in Soft Soldered Power Packages:
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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) ,
4
Solder Crack Improvement For A Power Package During TCT And..:
, In:
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36th International Electronics Manufacturing Technology Conference ,
6