Boettcher, Tim
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1

Kirkendall Voids in Soft Soldered Power Packages:

, In: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Boettcher, Tim ; Ilicali, Gurkan ; Birkoben, Tom... - p. 302-305 , 2023
 
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Solder Crack Improvement For A Power Package During TCT And..:

, In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),
Fan, Haibo ; Boettcher, Tim ; Li, Civen... - p. 1-4 , 2020
 
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6

A conceptual assembly study on enhancing the voltage capabi..:

, In: 36th International Electronics Manufacturing Technology Conference,
 
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7

A simple and effective method for the accurate extraction o..:

Khadke, Prashant ; Tichter, Tim ; Boettcher, Tim...
https://epub.uni-bayreuth.de/id/eprint/5871/1/s41598-021-87951-z.pdf.  , 2021
 
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