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Borecki, Janusz
14  results:
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1

Interconnect Stress Testing as a Tool for Assessment of Rel..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Glinski, Krzysztof ; Ostaszewski, Dariusz... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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2

Piezoresistive effect in embedded thick-film resistors:

Borecki, Janusz ; Araźna, Aneta ; Janeczek, Kamil...
Circuit World.  45 (2019)  1 - p. 31-36 , 2019
Link: https://doi.org/10.1108/..
 
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3

Thermal stability analysis of passive components embedded i..:

Stęplewski, Wojciech ; Dziedzic, Andrzej ; Janeczek, Kamil...
Circuit World.  44 (2018)  1 - p. 29-36 , 2018
Link: https://doi.org/10.1108/..
 
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4

The dependence of reliability and mechanical strength of th..:

Sitek, Janusz ; Koscielski, Marek ; Borecki, Janusz.
Soldering & Surface Mount Technology.  29 (2017)  1 - p. 23-27 , 2017
Link: https://doi.org/10.1108/..
 
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5

Assessment of stability and reliability of embedded compone..:

Steplewski, Wojciech ; Dziedzic, Andrzej ; Borecki, Janusz.
Circuit World.  43 (2017)  1 - p. 19-26 , 2017
Link: https://doi.org/10.1108/..
 
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6

Mechanical reliability of solder joints in PCBs assembled i..:

Borecki, Janusz ; Serzysko, Tomasz ; Agata Skwarek, Dr
Soldering & Surface Mount Technology.  28 (2016)  1 - p. 18-26 , 2016
Link: https://doi.org/10.1108/..
 
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7

Application of direct bonded copper substrates for prototyp..:

Grzesiak, Wojciech ; Maćków, Piotr ; Maj, Tomasz...
Circuit World.  42 (2016)  1 - p. 23-31 , 2016
Link: https://doi.org/10.1108/..
 
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8

Reactance components embedded in printed circuit boards:

Stęplewski, Wojciech ; Dziedzic, Andrzej ; Kłossowicz, Adam...
Circuit World.  41 (2015)  3 - p. 125-132 , 2015
Link: https://doi.org/10.1108/..
 
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9

Thermal effects in embedded thin- and thick-film resistors ..:

Steplewski, Wojciech ; Dziedzic, Andrzej ; Borecki, Janusz...
Circuit World.  40 (2014)  1 - p. 27-32 , 2014
Link: https://doi.org/10.1108/..
 
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10

Environmental tests of embedded thin- and thick-film resist..:

Steplewski, Wojciech ; Dziedzic, Andrzej ; Borecki, Janusz...
Circuit World.  40 (2014)  1 - p. 7-12 , 2014
Link: https://doi.org/10.1108/..
 
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11

Problems of PCB microvias filling by conductive paste:

Kisiel, Ryszard ; Felba, Jan ; Borecki, Janusz.
Microelectronics Reliability.  47 (2007)  2-3 - p. 335-341 , 2007
Link: https://doi.org/10.1016/..
 
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12

Conductive adhesives for through holes and blind vias metal..:

Kisiel, Ryszard ; Borecki, Janusz ; Kozioł, Grażyna.
Microelectronics Reliability.  45 (2005)  12 - p. 1935-1940 , 2005
Link: https://doi.org/10.1016/..
 
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13

Wpływ zmian klimatu na środowisko leśne ; Impacts of climat..:

Vesala, Timo ; Seppälä, Jyri ; Kilpeläinen, Antti...
Skrzecz, I., Sikora, K. (red.). (2023). Wpływ zmian klimatu na środowisko leśne. Instytut Badawczy Leśnictwa.  , 2023
Link: https://depot.ceon.pl/ha..
 
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14

Wpływ zmian klimatu na środowisko leśne / Impacts of climat..:

Timo Vesala ; Jyri Seppälä ; Antti Kilpeläinen...
isbn:978-83-62830-98-5.  , 2023
Link: https://zenodo.org/recor..
 
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