E-LIB Suche - Ergebnisse für: Botazzoli, Pietro

1

Testing and simulation of lifetime for wire bond interconne..:

Sippel, Marcel ; Tan, Yi Fong ; Schmidt, Ralf...
Microelectronics Reliability. 155 (2024) - p. 115348 , 2024

2

Influence of the Bond Foot Angle on Active Power Cycling Li..:

, In: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE),

Sippel, Marcel ; Tan, Yi Fong ; Schmidt, Ralf... - p. 1-7 , 2023

Link: https://doi.org/10.1109/..

3

Thermal Reduced Order Modelling of Multiple Power Modules o..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),

Kulkarni, Kajol ; Botazzoli, Pietro - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

4

Extension and validation of the TRANSURANUS burn-up model f..:

Botazzoli, Pietro ; Luzzi, Lelio ; Brémier, Stephane...
Journal of Nuclear Materials. 419 (2011) 1-3 - p. 329-338 , 2011

Link: https://doi.org/10.1016/..

5

Extension and validation of the TRANSURANUS Burn-up Model f..:

BOTAZZOLI Pietro ; LUZZI L ; BREMIER Stephan...
JRC58514. , 2011

Link: https://publications.jrc..