Bouvard, Didier
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1

Evaluation of thermocompressed nanoporous copper deposit to..:

Janod, Goulven ; Chachay, Lucas ; Schoenleber, Jonathan...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  , 2024
 
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4

Thermomechanical behavior of an alumina-mullite-zirconia re..:

Bigeard, Amélie ; Vespa, Pierrick ; Leplay, Paul...
Journal of the European Ceramic Society.  44 (2024)  2 - p. 1256-1266 , 2024
 
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8

Sintering 2023:

Wakai, Fumihiro ; Bordia, Rajendra K. ; Bouvard, Didier...
Ceramics International.  50 (2024)  19 - p. 37227 , 2024
 
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11

Effect of Large Amplitude Thermal Cycles on Power Assemblie..:

Botter, Nicolas ; Khazaka, Rabih ; Avenas, Yvan...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 211-218 , 2023
 
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13

Power Module Using Ceramic Heat Sink and Multilayers Silver..:

Botter, Nicolas ; Khazaka, Rabih ; Avenas, Yvan..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  12 (2022)  7 - p. 1082-1090 , 2022
 
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15

Copper additive manufacturing using MIM feedstock: adjustme..:

Singh, Gurminder ; Missiaen, Jean-Michel ; Bouvard, Didier.
The International Journal of Advanced Manufacturing Technology.  115 (2021)  1-2 - p. 449-462 , 2021
 
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