Bréchet, Y.
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6

Topological Optimization with Interfaces:

, In: Architectured Materials in Nature and Engineering; Springer Series in Materials Science,
Vermaak, N. ; Michailidis, G. ; Faure, A.... - p. 173-193 , 2019
 
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7

A New Microsystem Packaging Approach Using 3D Printing Enca..:

, In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),
Goubault, B. ; Aspar, G. ; Souriau, J.-C.... - p. 118-124 , 2018
 
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9

3D Printing as a New Packaging Approach for MEMS and Electr..:

, In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC),
Aspar, G. ; Goubault, B. ; Lebaigue, O.... - p. 1071-1079 , 2017
 
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10

A novel on chip test method to characterize the creep behav..:

Lapouge, P. ; Onimus, F. ; Vayrette, R....
Journal of Nuclear Materials.  476 (2016)  - p. 20-29 , 2016
 
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14

Damage and fracture of dual-phase steels: Influence of mart..:

Lai, Q. ; Bouaziz, O. ; Gouné, M....
Materials Science and Engineering: A.  646 (2015)  - p. 322-331 , 2015
 
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15

Overview of the current issues in austenite to ferrite tran..:

Gouné, M. ; Danoix, F. ; Ågren, J....
Materials Science and Engineering: R: Reports.  92 (2015)  - p. 1-38 , 2015
 
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