Brun, X.
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1

Enabling Next Generation 3D Heterogeneous Integration Archi..:

, In: 2022 International Electron Devices Meeting (IEDM),
Elsherbini, A. ; Jun, K. ; Liff, S.... - p. 27.3.1-27.3.4 , 2022
 
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2

Robust Estimator Design for Control of Electropneumatic Sys..:

Sidhom, L. ; Smaoui, M. ; Brun, X..
IETE Journal of Research.  64 (2017)  5 - p. 689-701 , 2017
 
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3

Thermal History Index as a bulk quality indicator for Czoch..:

Veirman, J. ; Martel, B. ; Letty, E....
Solar Energy Materials and Solar Cells.  158 (2016)  - p. 55-59 , 2016
 
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4

Pneumatic evoked potential. Sensory or auditive potential?:

Condé, S. ; Créac'h, C. ; Brun, X....
Neurophysiologie Clinique/Clinical Neurophysiology.  43 (2013)  3 - p. 189-195 , 2013
 
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5

Le potentiel évoqué pneumatique. Potentiel sensoriel ou aud..:

Peyron, R. ; Condé, S. ; Brun, X...
Neurophysiologie Clinique/Clinical Neurophysiology.  42 (2012)  4 - p. 261 , 2012
 
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7

Assessment of forceps use in obstetrics during a simulated ..:

Moreau, R. ; Pham, M. T. ; Brun, X...
The International Journal of Medical Robotics and Computer Assisted Surgery.  4 (2008)  4 - p. 373-380 , 2008
 
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8

High‐order sliding mode for an electropneumatic system: A r..:

Smaoui, M. ; Brun, X. ; Thomasset, D.
International Journal of Robust and Nonlinear Control.  18 (2007)  4-5 - p. 481-501 , 2007
 
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9

A study on tracking position control of an electropneumatic..:

Smaoui, M. ; Brun, X. ; Thomasset, D.
Control Engineering Practice.  14 (2006)  8 - p. 923-933 , 2006
 
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10

Higher order sliding mode control based on optimal approach..:

Laghrouche¶, S. ; Smaoui, M. ; Plestan, F..
International Journal of Control.  79 (2006)  2 - p. 119-131 , 2006
 
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11

Influence of the process design on the control strategy: ap..:

Brun, X. ; Thomasset, D. ; Bideaux, E.
Control Engineering Practice.  10 (2002)  7 - p. 727-735 , 2002
 
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12

A CMP Process for Hybrid Bonding Application with Conventio..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Widodo, T. S. ; Brun, X. F. ; Lianto, P.... - p. 2058-2061 , 2024
 
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13

Same size mold chase technology for effective stack die arc..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Deb, N. ; Tomita, Y. ; Brun, X. F.... - p. 29-33 , 2023
 
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14

300mm Full Thickness Si-Based IC Singulation Using Plasma D..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Surapaneni, R. ; Hamlin, B. S. ; Chiu, J.... - p. 1019-1024 , 2022
 
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15

Selective Epoxy Mold Compound Slurry for Advanced Packaging..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Widodo, T. S. ; Brun, X. F. ; Tsunoda, N.... - p. 1271-1276 , 2022
 
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