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2022 International Electron Devices Meeting (IEDM) ,
1
Enabling Next Generation 3D Heterogeneous Integration Archi..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
12
A CMP Process for Hybrid Bonding Application with Conventio..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
13
Same size mold chase technology for effective stack die arc..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
300mm Full Thickness Si-Based IC Singulation Using Plasma D..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
15