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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-t..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Towards Standardization of Hybrid Bonding Interface: In-dep..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
World's First UCIe Interoperability Silicon Enabling Open S..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Critical Dimension Scatterometry as a Scalable Solution for..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Impact of Thermal Annealing and Other Process Parameters on..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
6
Characterization of 300 mm Low Temperature SiCN PVD Films f..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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Low temperature Direct Bonding of SiN and SiO interfaces fo..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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