Brunet-Manquat, Mathias
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3

Warpage Study by Employing an Advanced Simulation Methodolo..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
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6

Scalable Through Molding Interconnection realization for ad..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
 
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8

Characterization of a SAW-Pirani vacuum sensor for two diff..:

Mercier, D. ; Bordel, G. ; Brunet-Manquat, P....
Sensors and Actuators A: Physical.  188 (2012)  - p. 41-47 , 2012
 
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9

Process and RF modelling of TSV last approach for 3D RF int..:

, In: 2011 IEEE International Interconnect Technology Conference,
Fuchs, C. ; Brunet-Manquat, C. ; Diaz, J.... - p. 1-3 , 2011
 
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