E-LIB Suche - Ergebnisse für: Burghartz, Joachim

1

An Integrated Optical Transceiver Circuit for Power Deliver..:

, In: ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC),

Frank, Alexander ; Anders, Jens ; Burghartz, Joachim... - p. 185-188 , 2022

Link: https://doi.org/10.1109/..

2

Integrated Optoelectronic Devices Using Lab‐On‐Fiber Techno..:

Ricciardi, Armando ; Zimmer, Michael ; Witz, Norbert...
Advanced Materials Technologies. 7 (2022) 9 - p. , 2022

Link: https://doi.org/10.1002/..

3

Vertical Gallium Nitride Power Devices: Fabrication and Cha..:

Hentschel, Rico , 2020

Link: https://nbn-resolving.de..

4

Towards Commercially Available Quartz Calibration Substrate:

, In: 2020 95th ARFTG Microwave Measurement Conference (ARFTG),

Galatro, Luca ; De Martino, Carmine ; van lt Hof, Jos... - p. 1-5 , 2020

Link: https://doi.org/10.1109/..

5

Miniaturized Optical Encoder with Micro Structured Encoder ..:

Seybold, Jonathan ; Bülau, André ; Fritz, Karl-Peter...
Applied Sciences. 9 (2019) 3 - p. 452 , 2019

Link: https://doi.org/10.3390/..

6

Bridging the gap between optical fibers and silicon photoni..:

Zaoui, Wissem Sfar ; Kunze, Andreas ; Vogel, Wolfgang...
Optics Express. 22 (2014) 2 - p. 1277 , 2014

Link: https://doi.org/10.1364/..

7

Patterned FeNi thin film for RF and microwave components:

Vroubel, Marina ; Zhuang, Yan ; Rejaei, Bezhad.
Journal of Magnetism and Magnetic Materials. 258-259 (2003) - p. 167-169 , 2003

Link: https://doi.org/10.1016/..

8

Integrierte Magnetfeldsensoren auf der Basis des Lateralen ..:

Burghartz, Joachim , [1987]

Copies: Zentrale:Magazin dn 9569

9

Comparative Study of Silver and Gold Source/Drain Contacts ..:

Wollandt, Tobias ; Letzkus, Florian ; Burghartz, Joachim N..
Advanced Electronic Materials. 10 (2024) 7 - p. , 2024

Link: https://doi.org/10.1002/..

10

A 97-Channel Read-Out ASIC for an Electrophysiological Mapp..:

Frank, Alexander ; Kootte, Bart ; Göttsche, Thorsten...
IEEE Transactions on Biomedical Circuits and Systems. 18 (2024) 1 - p. 76-88 , 2024

Link: https://doi.org/10.1109/..

11

Adaptive triple-fed antenna and thinned RF-chip integration..:

Fischer-Kennedy, Serafin B. ; Özbek, Sefa ; Wang, Shuo...
International Journal of Microwave and Wireless Technologies. 15 (2023) 8 - p. 1291-1298 , 2023

Link: https://doi.org/10.1017/..

12

PECVD SiNx passivation with more than 8 MV/cm breakdown str..:

Moser, Matthias ; Pradhan, Mamta ; Alomari, Mohammed...
Power Electronic Devices and Components. 4 (2023) - p. 100032 , 2023

Link: https://doi.org/10.1016/..

13

The European Flagship Conferences ESSDERC and ESSCIRC Merge..:

Burghartz, Joachim N. ; Steyaert, Michiel ; Claeys, Cor.
IEEE Solid-State Circuits Magazine. 15 (2023) 3 - p. 119-121 , 2023

Link: https://doi.org/10.1109/..

14

Flexible Ultrathin Chip-Film Patch for Electronic Component..:

Passlack, Ulrike ; Simon, Nicolai ; Bucher, Volker...
ACS Applied Materials & Interfaces. 15 (2023) 12 - p. 16221-16231 , 2023

Link: https://doi.org/10.1021/..

15

Novel Normally-Off AlGaN/GaN-on-Si MIS-HEMT Exploiting Nano..:

, In: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC),

Pradhan, Mamta ; Moser, Matthias ; Alomari, Mohammed.. - p. 400-403 , 2022

Link: https://doi.org/10.1109/..