Buttay, Cyril
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2

Graphite Heat Spreader Embedded in a PCB Package for Improv..:

, In: 2023 IEEE Energy Conversion Congress and Exposition (ECCE),
 
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3

An Advanced Integrated Cooling Solution for High Voltage an..:

, In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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4

Thermal management and packaging of wide and ultra-wide ban..:

Qin, Yuan ; Albano, Benjamin ; Spencer, Joseph...
Journal of Physics D: Applied Physics.  56 (2023)  9 - p. 093001 , 2023
 
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6

A Novel Packaging with Direct Dielectric Liquid Cooling for..:

, In: 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP),
 
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7

Design of a test package for high voltage SiC diodes:

, In: 2022 IEEE International Workshop on Integrated Power Packaging (IWIPP),
 
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9

A Guide for Accurate and Repeatable Measurement of the RTH,..:

, In: 2022 IEEE Energy Conversion Congress and Exposition (ECCE),
 
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10

12-kV 1-kA Breaking Capable Modular Power Electronic Interr..:

Liu, Jian ; Ravi, Lakshmi ; Buttay, Cyril...
IEEE Transactions on Industry Applications.  58 (2022)  5 - p. 6343-6356 , 2022
 
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11

Assessment of Partial Discharge Phenomenon in AC and Fast-r..:

, In: 2022 IEEE 21st International Conference on Dielectric Liquids (ICDL),
 
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12

A novel integrated cooling packaging for high power density..:

, In: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC),
 
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14

Break-even distance for MVDC electricity networks according..:

, In: 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe),
Le Metayer, Pierre ; Paez, Juan ; Toure, Selle... - p. 1-9 , 2021
 
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15

Electrical and optical partial discharge assessment of diel..:

, In: 2021 IEEE Electrical Insulation Conference (EIC),
Anand, Somya ; Vagnon, Eric ; Zouaghi, Ayyoub... - p. 602-605 , 2021
 
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