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Cale, Timothy S.
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1

THREE-DIMENSIONAL INTEGRATION IN MICROELECTRONICS: MOTIVATI..:

Cale, Timothy S. ; Lu, Jian-Qiang ; Gutmann, Ronald J.
Chemical Engineering Communications.  195 (2008)  8 - p. 847-888 , 2008
Link: https://doi.org/10.1080/..
 
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2

Stress-Induced Grain Boundary Migration in Polycrystalline ..:

Bloomfield, Max O. ; Bentz, Daniel N. ; Cale, Timothy S.
Journal of Electronic Materials.  37 (2007)  3 - p. 249-263 , 2007
Link: https://doi.org/10.1007/..
 
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3

Modeling multiscale effects on transients during chemical v..:

Gobbert, Matthias K. ; Cale, Timothy S.
Surface and Coatings Technology.  201 (2007)  22-23 - p. 8830-8837 , 2007
Link: https://doi.org/10.1016/..
 
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4

Grain–continuum modelling of material behaviour:

, In: Multiscale Materials Modelling,
Bloomfield, Max O. ; Cale, Timothy S. - p. 148-188 , 2007
Link: https://doi.org/10.1533/..
 
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5

Two deterministic approaches to topography evolution:

Cale, Timothy S. ; Bloomfield, Max O. ; Gobbert, Matthias K.
Surface and Coatings Technology.  201 (2007)  22-23 - p. 8873-8877 , 2007
Link: https://doi.org/10.1016/..
 
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6

A Galerkin Method for the Simulation of the Transient 2-D/2..:

Gobbert, Matthias K. ; Webster, Samuel G. ; Cale, Timothy S.
Journal of Scientific Computing.  30 (2006)  2 - p. 237-273 , 2006
Link: https://doi.org/10.1007/..
 
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7

A kinetic transport and reaction model and simulator for ra..:

Gobbert, Matthias K. ; Cale, Timothy S.
Journal of Computational Physics.  213 (2006)  2 - p. 591-612 , 2006
Link: https://doi.org/10.1016/..
 
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8

Thermal stresses in 3D IC inter-wafer interconnects:

Zhang, Jing ; Bloomfield, Max O. ; Lu, Jian-Qiang..
Microelectronic Engineering.  82 (2005)  3-4 - p. 534-547 , 2005
Link: https://doi.org/10.1016/..
 
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9

Nanoplate elasticity under surface reconstruction:

Shim, Hyun Woo ; Zhou, L. G. ; Huang, Hanchen.
Applied Physics Letters.  86 (2005)  15 - p. , 2005
Link: https://doi.org/10.1063/..
 
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10

Formation and evolution of grain structures in thin films:

Bloomfield, Max O. ; Cale, Timothy S.
Microelectronic Engineering.  76 (2004)  1-4 - p. 195-204 , 2004
Link: https://doi.org/10.1016/..
 
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11

Material removal model for chemical–mechanical polishing co..:

Seok, Jongwon ; Sukam, Cyriaque P. ; Kim, Andrew T...
Wear.  257 (2004)  5-6 - p. 496-508 , 2004
Link: https://doi.org/10.1016/..
 
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12

Model relating process variables to film electrical propert..:

Jain, Pushkar ; Bhagwat, Vinay ; Rymaszewski, Eugene J....
Journal of Applied Physics.  93 (2003)  6 - p. 3596-3604 , 2003
Link: https://doi.org/10.1063/..
 
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13

Modeling Pattern Density Dependent Bump Formation in Copper..:

Im, Yeon Ho ; Bloomfield, Max O. ; Sen, Suchira.
Electrochemical and Solid-State Letters.  6 (2003)  3 - p. C42 , 2003
Link: https://doi.org/10.1149/..
 
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14

A computational framework for modelling grain-structure evo..:

Bloomfield, Max O. ; Richards, David F. ; Cale†, Timothy S.
Philosophical Magazine.  83 (2003)  31-34 - p. 3549-3568 , 2003
Link: https://doi.org/10.1080/..
 
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15

Multiscale material removal modeling of chemical mechanical..:

Seok, Jongwon ; Sukam, Cyriaque P ; Kim, Andrew T..
Wear.  254 (2003)  3-4 - p. 307-320 , 2003
Link: https://doi.org/10.1016/..
 
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