Cao, Lihong
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2

Advanced Thermocompression Bonding on High Density Fan-Out ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wudjud, Wiwy ; Lin, ShuYu ; Chang, Yungshun... - p. 929-935 , 2024
 
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3

Development of a novel ternary FeWO4/CoP/Mn0.5Cd0.5S compos..:

Qian, Haixia ; Cao, Lihong ; Lu, Xuanjin...
Colloids and Surfaces A: Physicochemical and Engineering Aspects.  682 (2024)  - p. 132935 , 2024
 
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4

Moving Towards Microchannel-based Chip Cooling:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Semenza, Paul ; Thomas, Dave ; Oakes, Garrett... - p. 408-414 , 2024
 
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5

Self-supervised Video Representation Learning via Capturing..:

Lai, Qiuxia ; Zeng, Ailing ; Wang, Ye...
IEEE Transactions on Circuits and Systems for Video Technology.  , 2024
 
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8

Research of Multidimensional Adversarial Examples in LLMs f..:

, In: Computer Science and Education. Educational Digitalization; Communications in Computer and Information Science,
Liu, Kainan ; Li, Yifan ; Cao, Lihong... - p. 286-302 , 2024
 
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10

Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1048-1053 , 2024
 
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11

A Chinese verb semantic feature dataset (CVFD):

Deng, Yaling ; Li, Jiwen ; Niu, Minglu...
Behavior Research Methods.  56 (2023)  1 - p. 342-361 , 2023
 
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13

Advanced Packaging Design Platform for Chiplets and Heterog..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Cao, Lihong ; Wang, Chen-Chao ; Huang, Chih-Yi. - p. 1032-1037 , 2023
 
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