Cao, Yusheng
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1

Automated Fault Diagnosis Technology for Modular Multilevel..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Zhang, Dewen ; Lu, Hang ; Xu, Chuancai... - p. 377-381 , 2024
 
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3

Orbital angular momentum modes in dielectrically chiral-cor..:

Dirbeba, Gebeyehu ; Li, Junqing ; Cao, Yusheng...
Journal of Physics D: Applied Physics.  57 (2024)  34 - p. 345103 , 2024
 
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5

Novel In-Vehicle Gesture Interactions: Design and Evaluatio..:

, In: Proceedings of the 15th International Conference on Automotive User Interfaces and Interactive Vehicular Applications,
 
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6

Chatterbox Opener: A Game to Support Healthy Communication ..:

, In: Companion Proceedings of the Annual Symposium on Computer-Human Interaction in Play,
Wang, Wei-Lu ; Haqq, Derek ; Saaty, Morva... - p. 43-48 , 2023
 
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7

Increasing Driving Safety and In-Vehicle Gesture-Based Menu..:

, In: Adjunct Proceedings of the 14th International Conference on Automotive User Interfaces and Interactive Vehicular Applications,
Cao, Yusheng ; Li, Lingyu ; Yuan, Jiehao. - p. 212-214 , 2022
 
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9

Advancing In-vehicle Gesture Interactions with Adaptive Han..:

, In: 13th International Conference on Automotive User Interfaces and Interactive Vehicular Applications,
Tabbarah, Moustafa ; Cao, Yusheng ; Liu, Yi. - p. 204-206 , 2021
 
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11

Efficient full-vectorial modal analysis based on immersed i..:

Cao, Yusheng
Journal of the Optical Society of America A.  36 (2019)  12 - p. 1957 , 2019
 
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13

Study on the electrical performance of Au bump in FC cerami..:

, In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Feng ; Hu, Peifeng ; Ding, Yajun... - p. 1517-1519 , 2017
 
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14

The finite element analysis on reliability of gold bump:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Liu, Jiansong ; Yao, Quanbin ; Lin, Pengrong.. - p. 1330-1333 , 2016
 
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15

Study on the electrical performance of one differential pai..:

, In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT),
Lu, Feng ; Cao, Yusheng ; Lian, Binhao - p. 1327-1329 , 2016
 
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