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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Low temperature backside damascene processing on temporary ..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Confined IMCs for low temperature and high throughput D2W b..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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A novel iso-thermal intermetallic compound insertion bondin..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
4
10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:
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2019 International 3D Systems Integration Conference (3DIC) ,
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Process Complexity and Cost Considerations of Multi-Layer D..:
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2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ,
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