Capuz, Giovanni
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1

Low temperature backside damascene processing on temporary ..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Derakhshandeh, Jaber ; Beyne, Eric ; Beyer, Gerald... - p. 1108-1113 , 2022
 
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2

Confined IMCs for low temperature and high throughput D2W b..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
 
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3

A novel iso-thermal intermetallic compound insertion bondin..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Hou, Lin ; Derakhshandeh, Jaber ; Capuz, Giovanni... - p. 1442-1447 , 2020
 
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4

10 and 7 μm Pitch Thermo-compression Solder Joint, Using A ..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
 
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5

Process Complexity and Cost Considerations of Multi-Layer D..:

, In: 2019 International 3D Systems Integration Conference (3DIC),
 
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6

Packaging Material Evaluation for 2.5D/3D TSV Application:

Mitsukura, Kazuyuki ; Makino, Tatsuya ; Hatakeyama, Keiichi...
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-011-1-E16-011-7 , 2016
 
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7

3D Stacking Using Bump-Less Process for Sub 10um Pitch Inte..:

, In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC),
 
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