Chaitanya, K. Sai Krishna
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1

AI-Based Design of Hybrid Ionic Polymer–Metal Composite wit..:

Chaitanya, K. Sai Krishna ; Datta, Shubhabrata
Journal of The Institution of Engineers (India): Series D.  103 (2022)  1 - p. 37-44 , 2022
 
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2

Reliable Low-Cost High-Speed and Direction-Controlled Surve..:

, In: Smart Computing Techniques and Applications; Smart Innovation, Systems and Technologies,
Rooban, S. ; Eshwar, I. Venkata Sai ; Radhika, R... - p. 365-375 , 2021
 
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Full-text Search Using Database Index:

, In: 2019 5th International Conference On Computing, Communication, Control And Automation (ICCUBEA),
 
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A Review of Bidirectional DC-DC,DC-AC Converters for V2G an..:

, In: 2023 International Conference on Power, Instrumentation, Energy and Control (PIECON),
 
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A Comparative Study of AI Algorithms for Anomaly-based Intr..:

, In: 2023 7th International Conference on Computing Methodologies and Communication (ICCMC),
 
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9

Pursuance and influence assessment of nanoadditives blended..:

Yoganand, K. ; Elango, Suriya ; Sai Srivathsan, C. B...
International Journal of Ambient Energy.  43 (2020)  1 - p. 2146-2152 , 2020
 
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10

Autonomous Human Detection System Mounted on a Drone:

, In: 2019 International Conference on Wireless Communications Signal Processing and Networking (WiSPNET),
 
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11

A Novel Women Safety Analyis and Monitoring Sysetm over Soc..:

, In: 2023 3rd International Conference on Intelligent Technologies (CONIT),
 
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12

A Review on Women Safety in India using Machine Learning on..:

, In: 2022 Second International Conference on Advanced Technologies in Intelligent Control, Environment, Computing & Communication Engineering (ICATIECE),
 
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13

Saliva a mirror to oral health in neurofibromatosis type-1 ..:

Kondapaneni, Jayasurya ; Thota, Eshwar ; Chaitanya, Nallan C.S.K....
Oral Surgery, Oral Medicine, Oral Pathology and Oral Radiology.  129 (2020)  1 - p. e188-e189 , 2020
 
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15

Handwritten Digit Recognition using Convolutional Neural Ne..:

, In: 2023 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC),
 
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