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2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) ,
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One-Dimensional Deep Image Prior for Curve Fitting of S-Par..:
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2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Efficient Boundary Element Methodology for Analyzing Interc..:
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Fast and Accurate Modeling of PCB Differential Trace Skew C..:
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2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
4
Modeling Finite Dielectric Structures Embedded in Layered M..:
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2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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On the Accuracy of Cross-Talk Modeling in High-Speed Digita..:
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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) ,
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Modeling Surface Roughness at DC:
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Proceedings of the 43rd annual Design Automation Conference ,
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A parallel low-rank multilevel matrix compression algorithm..:
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Proceedings of the 41st annual Design Automation Conference ,
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