Search for persons
X
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
1
High-Reliability Solder Pastes For Automotive Applications ..:
, In:
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Alternative 3D Double Side Molded SiP for 5G Communication:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Effects of Corner/Edge Bond and Side-fill for Automotive MC..:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
4