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Chang, Chih Tao
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1

The Study of Comparative Characterization between SiC MOSFE..:

Lee, Heng ; Liu, Chun Kai ; Chang, Tao Chih
Materials Science Forum.  1004 (2020)  - p. 1045-1053 , 2020
Link: https://doi.org/10.4028/..
 
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2

In Situ Synchrotron X-ray Diffraction Measurement of the St..:

Hsu, Hsueh Hsien ; Chen, Hao ; Ouyang, Yao Tsung...
Journal of Electronic Materials.  44 (2015)  10 - p. 3942-3947 , 2015
Link: https://doi.org/10.1007/..
 
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3

Solder Joint Lifetime Characterization of a SiC Power MOSFE..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, He-Hong ; Cheng, Hsien-Chie ; Liu, Yan-Cheng... - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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4

Power Cycling Modeling and Lifetime Evaluation of SiC Power..:

Cheng, Hsien-Chie ; Syu, Ji-Yuan ; Wang, He-Hong...
IEEE Transactions on Device and Materials Reliability.  24 (2024)  1 - p. 142-153 , 2024
Link: https://doi.org/10.1109/..
 
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5

Development and Performance Evaluation of Integrated Hybrid..:

Cheng, Hsien-Chie ; Liu, Yan-Cheng ; Lin, Hsin-Han...
Micromachines.  14 (2023)  7 - p. 1356 , 2023
Link: https://doi.org/10.3390/..
 
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6

A hybrid bonding interconnection with a novel low-temperatu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Chang, Po-Chih ; Lee, Ou-Hsiang... - p. 2128-2134 , 2022
Link: https://doi.org/10.1109/..
 
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7

Estimation of Switching Transients and Power Losses of SiC-..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Liu, Yan-Cheng ; Cheng, Hsien-Chie ; Lin, Hsin-Han... - p. 159-160 , 2022
Link: https://doi.org/10.23919..
 
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8

Characteristic Analysis of a Multi-chip Embedded Interposer..:

, In: 2022 International Conference on Electronics Packaging (ICEP),
Lee, Ching Kuan ; Liu, Wen-Hung ; Chang, Shu-Yi... - p. 55-56 , 2022
Link: https://doi.org/10.23919..
 
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9

High density batch bonding technology for chiplet design:

, In: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Ni, Tzu-Hsuan.. - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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10

Low temperature Ag-Ag direct bonding under air atmosphere:

Chang, Leh-Ping ; Huang, Shin-Yi ; Chang, Tao-Chih.
Journal of Alloys and Compounds.  862 (2021)  - p. 158587 , 2021
Link: https://doi.org/10.1016/..
 
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11

Reliability evaluation of ultra thin 3D-IC package under th..:

Lee, Chang-Chun ; Lin, Yu-Min ; Liu, Hou-Chun...
Microelectronic Engineering.  244-246 (2021)  - p. 111572 , 2021
Link: https://doi.org/10.1016/..
 
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12

Packaging reliability estimation of high-power device modul..:

Lee, Chang-Chun ; Kuo, Kuo-Shu ; Wang, Chi-Wei...
Microelectronics Reliability.  114 (2020)  - p. 113890 , 2020
Link: https://doi.org/10.1016/..
 
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13

Low Temperature SLID Bonding Approach in Fine Pitch Chip-st..:

Chen, Chao-Jung ; Lin, Yu-Min ; Ni, Tzu-Hsuan...
Transactions of The Japan Institute of Electronics Packaging.  13 (2020)  0 - p. E20-010-1-E20-010-4 , 2020
Link: https://doi.org/10.5104/..
 
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14

A new failure mechanism of electromigration by surface diff..:

Chang, Yuan-Wei ; Hu, Chia-chia ; Peng, Hsin-Ying...
Scientific Reports.  8 (2018)  1 - p. , 2018
Link: https://doi.org/10.1038/..
 
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15

Development of Cu-Ag pastes for high temperature sustainabl..:

Hsiao, Ching-Huan ; Kung, Wan-Ting ; Song, Jenn-Ming..
Materials Science and Engineering: A.  684 (2017)  - p. 500-509 , 2017
Link: https://doi.org/10.1016/..
 
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