Chang, H. Y.
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2

Pre-fabricated High-density TSV Interposer for Programmable..:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ouyang, T. Y. ; Hung, Y. T. ; Lee, O. H.... - p. 1-4 , 2022
 
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3

Optimization of Temporary Wafer Bonding Materials and Proce..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K. - p. 36-39 , 2020
 
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4

Effects of transforming growth factor‐β1 on plasminogen act..:

Chang, M. C. ; Chang, H. H. ; Hsieh, W. C....
International Endodontic Journal.  53 (2020)  5 - p. 647-659 , 2020
 
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5

Evaluation of Laser Releasable Temporary Bonding Adhesives ..:

, In: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Ou-Yang, T. Y. ; Chang, H. H. ; Hsu, C. K... - p. 32-35 , 2020
 
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7

The interation of Gemini biquaternary ammonium salt surfact..:

Chang, H. H. ; Cui, Y. ; Jia, Z. G....
Energy Sources, Part A: Recovery, Utilization, and Environmental Effects.  38 (2016)  19 - p. 2936-2941 , 2016
 
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A Theoretical Investigation of Surface‐enhanced Sum‐frequen..:

Yeh, Y. L. ; Lei, J. ; Chen, S. Y....
Journal of the Chinese Chemical Society.  63 (2015)  1 - p. 136-144 , 2015
 
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10

Predictors of uropathogens other thanEscherichia coliin pat..:

Wi, Y. M. ; Kim, S.-W. ; Chang, H.-H....
International Journal of Clinical Practice.  68 (2014)  6 - p. 749-755 , 2014
 
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11

Growth and characterization of superconductingβ-FeSe type i..:

Chang, H H ; Chang, C C ; Chiang, Y Y...
Superconductor Science and Technology.  27 (2014)  2 - p. 025015 , 2014
 
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12

Theoretical Study on Reaction Mechanism of Ground-State Cya..:

Sun, B. J. ; Huang, C. H. ; Chen, S. Y....
The Journal of Physical Chemistry A.  118 (2014)  36 - p. 7715-7724 , 2014
 
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15

The Evolution and Functional Significance of Nested Gene St..:

Lee, Y. C. G. ; Chang, H.-H.
Genome Biology and Evolution.  5 (2013)  10 - p. 1978-1985 , 2013
 
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