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Chang, Hsiang-Hung
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1

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low-Temperature Area-Selective Metal Passivation Bonding Pl..:

Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Chen, Chi-Yu...
IEEE Electron Device Letters.  45 (2024)  7 - p. 1273-1276 , 2024
Link: https://doi.org/10.1109/..
 
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3

In-situ measurement of thermal expansion in Cu/SiO2 hybrid ..:

Lin, Huai-En ; Tran, Dinh-Phuc ; Chiu, Wei-Lan..
Applied Surface Science.  662 (2024)  - p. 160103 , 2024
Link: https://doi.org/10.1016/..
 
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4

Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Li, Chen-Ning ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 109-110 , 2024
Link: https://doi.org/10.23919..
 
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5

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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6

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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7

Characterization of Surface Activation on Nanotwinned Coppe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Rou-Jun ; He, Pin-Syuan ; Chiu, Wei-Lan... - p. 77-78 , 2024
Link: https://doi.org/10.23919..
 
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8

Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chiu, Wei-Lan ; Lee, Ou-Hsiang ; Chang, Hsiang-Hung... - p. 319-324 , 2024
Link: https://doi.org/10.1109/..
 
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9

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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10

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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11

Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Huai-En ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 816-820 , 2024
Link: https://doi.org/10.1109/..
 
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12

Surface Modification by Wet Treatment for Low-Temperature C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan.. - p. 115-116 , 2024
Link: https://doi.org/10.23919..
 
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13

Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hy..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 399-403 , 2024
Link: https://doi.org/10.1109/..
 
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14

Surface modification on hydrophilicity enhancement using NH..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Ong, Jia-Juen ; Tran, Dinh-Phuc ; Chiu, Wei-Lan... - p. 1549-1552 , 2023
Link: https://doi.org/10.1109/..
 
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15

Fine-pitch -oriented NT-Cu/SiO2 hybrid joints with high the..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Ong, Jia-Juen ; Chiu, Wei-Lan ; Chang, Hsiang-Hung.. - p. 15-16 , 2023
Link: https://doi.org/10.23919..
 
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