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Chang, Hsiang-Kuan
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1

Assessing the effective spatial characteristics of input fe..:

Jhong, Bing-Chen ; Lin, Chung-Yi ; Jhong, You-Da...
Hydrological Sciences Journal.  67 (2022)  10 - p. 1527-1545 , 2022
Link: https://doi.org/10.1080/..
 
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2

Using Tabu Search Adjusted with Urban Sewer Flood Simulatio..:

Liao, Hao-Yu ; Pan, Tsung-Yi ; Chang, Hsiang-Kuan...
Water.  11 (2019)  2 - p. 348 , 2019
Link: https://doi.org/10.3390/..
 
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3

A Support Vector Machine Forecasting Model for Typhoon Floo..:

Chang, Ming-Jui ; Chang, Hsiang-Kuan ; Chen, Yun-Chun...
Water.  10 (2018)  12 - p. 1734 , 2018
Link: https://doi.org/10.3390/..
 
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4

Methodology to set trigger levels in an urban drainage floo..:

Chang, Hsiang-Kuan ; Lin, Yong-Jun ; Lai, Jihn-Sung
Hydrological Sciences Journal.  63 (2017)  1 - p. 31-49 , 2017
Link: https://doi.org/10.1080/..
 
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5

Improvement of a drainage system for flood management with ..:

Chang, Hsiang-Kuan ; Tan, Yih-Chi ; Lai, Jihn-Sung...
Hydrological Sciences Journal.  58 (2013)  8 - p. 1581-1597 , 2013
Link: https://doi.org/10.1080/..
 
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6

Coupling typhoon rainfall forecasting with overland-flow mo..:

Pan, Tsung-Yi ; Chang, Lung-Yao ; Lai, Jihn-Sung...
Natural Hazards.  70 (2012)  3 - p. 1763-1793 , 2012
Link: https://doi.org/10.1007/..
 
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7

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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8

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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9

Low-Temperature Area-Selective Metal Passivation Bonding Pl..:

Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Chen, Chi-Yu...
IEEE Electron Device Letters.  45 (2024)  7 - p. 1273-1276 , 2024
Link: https://doi.org/10.1109/..
 
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10

A Novel Polymer-Based Ultra-High Density Bonding Interconne..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Yang, Tsung-Yu Ou ; Lee, Ou-Hsiang... - p. 1779-1784 , 2023
Link: https://doi.org/10.1109/..
 
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11

TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid B..:

Hung, Tzu-Heng ; Lo, James Yi-Jen ; Kuo, Tzu-Ying...
IEEE Electron Device Letters.  44 (2023)  7 - p. 1176-1179 , 2023
Link: https://doi.org/10.1109/..
 
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12

Ultrasound Imaging of the Facial Muscles and Relevance with..:

Wu, Wei-Ting ; Chang, Ke-Vin ; Chang, Hsiang-Chi...
Toxins.  14 (2022)  2 - p. 101 , 2022
Link: https://doi.org/10.3390/..
 
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13

Ultrasound Imaging of Facial Vascular Neural Structures and..:

Wu, Wei-Ting ; Chang, Ke-Vin ; Chang, Hsiang-Chi...
Diagnostics.  12 (2022)  7 - p. 1766 , 2022
Link: https://doi.org/10.3390/..
 
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14

A hybrid bonding interconnection with a novel low-temperatu..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Lin, Yu-Min ; Chang, Po-Chih ; Lee, Ou-Hsiang... - p. 2128-2134 , 2022
Link: https://doi.org/10.1109/..
 
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15

Reliability Evaluation for Integrated Glass Interposer:

Lee, Ching-Kuan ; Wang, Jen-Chun ; Chang, Hsiang-Hung.
Transactions of The Japan Institute of Electronics Packaging.  9 (2016)  0 - p. E16-009-1-E16-009-5 , 2016
Link: https://doi.org/10.5104/..
 
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