Chang, Kai-Chun
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1

Phase transformation on HZO ferroelectric layer in ferroele..:

Wu, Chung-Wei ; Chen, Po-Hsun ; Chang, Ting-Chang...
Semiconductor Science and Technology.  39 (2024)  2 - p. 025002 , 2024
 
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2

The Transition of Threshold Voltage Shift of Al2O3/Si3N4 Al..:

Lee, Ya-Huan ; Chang, Kai-Chun ; Tai, Mao-Chou...
IEEE Transactions on Electron Devices.  71 (2024)  3 - p. 1792-1797 , 2024
 
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3

Analysis of Abnormal C–V Hump on Si3N4 MIS-HEMT With Mesa I..:

Lee, Ya-Huan ; Chang, Kai-Chun ; Lin, Hsin-Ni...
IEEE Transactions on Electron Devices.  71 (2024)  4 - p. 2349-2354 , 2024
 
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6

An Unsupervised Learning Method for Indirect Bridge Structu..:

, In: Lecture Notes in Civil Engineering; Experimental Vibration Analysis for Civil Engineering Structures,
 
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7

Automated Answer Type Recognition for Primary School Studen..:

, In: Chinese Language Resources; Text, Speech and Language Technology,
Chang, Ru-Yng ; Chang, Kai-Chun ; Liu, Nien-Chi... - p. 581-610 , 2023
 
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8

Analysis of Breakdown-Voltage Increase on SiC Junction Barr..:

Jin, Fu-Yuan ; Chen, Po-Hsun ; Hung, Wei-Chun...
IEEE Transactions on Electron Devices.  70 (2023)  1 - p. 191-195 , 2023
 
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10

High-Throughput CBC Mode Crypto Circuit:

Chang, Kai-Chun ; Teng, You-Tun ; Chin, Wen-Long
Electrical Science & Engineering.  5 (2023)  1 - p. 21-31 , 2023
 
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11

Detection and Analysis of Phalaenopsis Fusarium Wilt Using ..:

, In: IGARSS 2023 - 2023 IEEE International Geoscience and Remote Sensing Symposium,
Chang, Kai-Chun ; Chou, Shao-An ; Shih, Min-Shao... - p. 5305-5308 , 2023
 
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13

Development of a comprehensive model for predicting melt po..:

Anand, Nitesh ; Chang, Kai-Chun ; Yeh, An-Chou..
Journal of Materials Processing Technology.  319 (2023)  - p. 118069 , 2023
 
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14

Bridge Response Fusion Drive-by-Bridge Inspection by Means ..:

, In: Lecture Notes in Civil Engineering; Experimental Vibration Analysis for Civil Engineering Structures,
 
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15

Analysis of Hump Effect Induced by Positive Bias Temperatur..:

Hung, Wei-Chieh ; Jin, Fu-Yuan ; Chang, Ting-Chang...
IEEE Transactions on Device and Materials Reliability.  23 (2023)  2 - p. 263-268 , 2023
 
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