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2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) ,
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Board Level Probe-on-Pin Power Delivery Network Characteriz..:
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2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) ,
2
Power Design Validation of Two-Stage Power System:
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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Board Design Architecture and optimization for High-power 4..:
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) ,
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Design Technique on Reduction of Power Cross Regulation and..:
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Proceedings of the 27th annual international symposium on Microarchitecture ,
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