Search for persons
X
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
1
Improved Compact Thermal Model for Over-Molded Packages:
, In:
?
Lecture Notes in Computer Science; Trends and Applications in Knowledge Discovery and Data Mining ,
5
Adaptive Knowledge Sharing in Multi-Task Learning: Insights..:
, In:
?
Lecture Notes in Electrical Engineering; Progressive and Integrative Ideas and Applications of Engineering Systems Under the Framework of IOT and AI ,
10