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Proceedings of the 2024 International Symposium on Physical Design ,
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Multi-Electrostatics Based Placement for Non-Integer Multip..:
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2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) ,
3
Multi-Product Optimization for 3D Heterogeneous Integration..:
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Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design ,
4
Multi-Package Co-Design for Chiplet Integration:
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Proceedings of the 24th edition of the great lakes symposium on VLSI ,
6
A study on the use of parallel wiring techniques for sub-20..:
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Proceedings of the International Conference on Computer-Aided Design ,
7
Scaling the "memory wall":
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Proceedings of the 16th Asia and South Pacific Design Automation Conference ,
8
Mask cost reduction with circuit performance consideration ..:
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Proceedings of the International Conference on Computer-Aided Design ,
9
High-quality global routing for multiple dynamic supply vol..:
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Proceedings of the 16th Asia and South Pacific Design Automation Conference ,
10
Simultaneous redundant via insertion and line end extension..:
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Proceedings of the 2010 Asia and South Pacific Design Automation Conference ,
11
Configurable multi-product floorplanning:
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Proceedings of the 2010 Asia and South Pacific Design Automation Conference ,
12
On process-aware 1-D standard cell design:
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Proceedings of the 47th Design Automation Conference ,
13
Multi-threaded collision-aware global routing with bounded-..:
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Proceedings of the 2009 international symposium on Physical design ,
14
Wire shaping is practical:
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Proceedings of the 46th Annual Design Automation Conference ,
15
Spare-cell-aware multilevel analytical placement:
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