Charbonnier, Thomas
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9

Process Development and Characterization of Ru-based UBM fo..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tulzo, Harold Le ; Bijou, Diane ; Souza, Therese... - p. 378-385 , 2024
 
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11

Integration of planarized Nb-based vias to form a multi-lev..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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12

Fine pitch Nb-Nb Direct Bonding for quantum applications:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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