Chason, E.
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1

The Effects of Plating Current, Grain Size, and Electrolyte..:

Rao, Z. ; Hearne, S. J. ; Chason, E.
Journal of The Electrochemical Society.  166 (2018)  1 - p. D3212-D3218 , 2018
 
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2

Residual Stress in Electrodeposited Cu Thin Films: Understa..:

Engwall, A. M. ; Rao, Z. ; Chason, E.
Journal of The Electrochemical Society.  164 (2017)  13 - p. D828-D834 , 2017
 
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7

Significance of Nucleation Kinetics in Sn Whisker Formation:

Chason, E. ; Pei, F. ; Briant, C. L...
Journal of Electronic Materials.  43 (2014)  12 - p. 4435-4441 , 2014
 
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10

Evaluation of stress during and after sputter deposition of..:

Navid, A.A. ; Chason, E. ; Hodge, A.M.
Surface and Coatings Technology.  205 (2010)  7 - p. 2355-2361 , 2010
 
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11

Stress-enhanced pattern formation on surfaces during low en..:

Medhekar, N V ; Chan, W L ; Shenoy, V B.
Journal of Physics: Condensed Matter.  21 (2009)  22 - p. 224021 , 2009
 
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12

Kinetic Monte Carlo simulations compared with continuum mod..:

Chason, E ; Chan, W L
Journal of Physics: Condensed Matter.  21 (2009)  22 - p. 224016 , 2009
 
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13

Plastic deformation processes in Cu/Sn bimetallic films:

Kumar, K.S. ; Reinbold, L. ; Bower, A.F..
Journal of Materials Research.  23 (2008)  11 - p. 2916-2934 , 2008
 
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