E-LIB Suche - Ergebnisse für: Che Ani, F.

1

Thermal cycling effect on the crack formation of solder joi..:

Suhaimi, M. F. ; Abu Bakar, M. ; Jalar, A...
Journal of Physics: Conference Series. 2169 (2022) 1 - p. 012006 , 2022

2

Effect of stencil wall aperture on solder paste release via..:

Mohamed Sunar, M. S. ; Abu Bakar, M. ; Jalar, A...
Journal of Physics: Conference Series. 2169 (2022) 1 - p. 012037 , 2022

Link: https://doi.org/10.1088/..

3

The influence of Fe2O3 nano-reinforced SAC lead-free solder..:

Che Ani, F. ; Jalar, A. ; Saad, A. A....
The International Journal of Advanced Manufacturing Technology. 96 (2018) 1-4 - p. 717-733 , 2018

Link: https://doi.org/10.1007/..

4

Numerical simulation of self-alignment of chip resistor com..:

Najib, A.M. ; Abdullah, M.Z. ; Saad, A.A...
Microelectronics Reliability. 79 (2017) - p. 69-78 , 2017

Link: https://doi.org/10.1016/..

5

Discrete phase method particle simulation of ultra-fine pac..:

Haslinda, M.S. ; Abas, Aizat ; Che Ani, F....
Microelectronics Reliability. 79 (2017) - p. 336-351 , 2017

Link: https://doi.org/10.1016/..

6

Discrete phase method study of ball grid array underfill pr..:

Ng, Fei Chong ; Abas, Aizat ; Gan, Z.L....
Microelectronics Reliability. 72 (2017) - p. 45-64 , 2017

Link: https://doi.org/10.1016/..

7

Lattice Boltzmann method study of bga bump arrangements on ..:

Abas, Aizat ; Ishak, M.H.H. ; Abdullah, M.Z...
Microelectronics Reliability. 56 (2016) - p. 170-181 , 2016

Link: https://doi.org/10.1016/..

8

Effect of ILU dispensing types for different solder bump ar..:

Abas, Aizat ; M.S., Haslinda ; Ishak, M.H.H....
Microelectronic Engineering. 163 (2016) - p. 83-97 , 2016

Link: https://doi.org/10.1016/..

9

Backward Compatibility Solder Joint Formation at High Peak ..:

Che Ani, F. ; Jalar, A. ; Ismail, R....
Arabian Journal for Science and Engineering. 41 (2015) 5 - p. 1813-1823 , 2015

Link: https://doi.org/10.1007/..

10

Finite volume-based simulation of the wave soldering proces..:

Abdul Aziz, M. S. ; Abdullah, M. Z. ; Khor, C. Y....
Numerical Heat Transfer, Part A: Applications. 69 (2015) 3 - p. 295-310 , 2015

Link: https://doi.org/10.1080/..

11

Implications of Adjustable Fountain Wave in Pin Through Hol..:

Abdul Aziz, M. S. ; Abdullah, M. Z. ; Khor, C. Y....
Arabian Journal for Science and Engineering. 39 (2014) 12 - p. 9101-9111 , 2014

Link: https://doi.org/10.1007/..

12

CFD modeling of pin shape effects on capillary flow during ..:

Abdul Aziz, M.S. ; Abdullah, M.Z. ; Khor, C.Y...
International Journal of Heat and Mass Transfer. 72 (2014) - p. 400-410 , 2014

Link: https://doi.org/10.1016/..

13

Computational fluid dynamic and thermal analysis for BGA as..:

Lau, Chun‐Sean ; Abdullah, M.Z. ; Che Ani, F.
Soldering & Surface Mount Technology. 24 (2012) 2 - p. 77-91 , 2012

Link: https://doi.org/10.1108/..

14

Three‐dimensional thermal investigations at board level in ..:

Lau, Chun‐Sean ; Abdullah, M.Z. ; Che Ani, F.
Soldering & Surface Mount Technology. 24 (2012) 3 - p. 167-182 , 2012

Link: https://doi.org/10.1108/..

15

Optimization modeling of the cooling stage of reflow solder..:

Lau, Chun-Sean ; Abdullah, M.Z. ; Che Ani, F.
Microelectronics Reliability. 52 (2012) 6 - p. 1143-1152 , 2012

Link: https://doi.org/10.1016/..