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Chen, Chih
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1

The Enhancement in the Reliability of Nanotwinned Cu Redist..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hung, Yu-Wen ; Lin, Yi-Quan ; Chen, Chih - p. 103-104 , 2024
Link: https://doi.org/10.23919..
 
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2

In-situ measurement of thermal expansion in Cu/SiO2 hybrid ..:

Lin, Huai-En ; Tran, Dinh-Phuc ; Chiu, Wei-Lan..
Applied Surface Science.  662 (2024)  - p. 160103 , 2024
Link: https://doi.org/10.1016/..
 
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3

Effects of Cu/SnAgCu Powder Fraction and Sintering Time on ..:

Tran, Dinh-Phuc ; Liu, Yu-Ting ; Chen, Chih
Materials.  17 (2024)  9 - p. 2004 , 2024
Link: https://doi.org/10.3390/..
 
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4

Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Li, Chen-Ning ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 109-110 , 2024
Link: https://doi.org/10.23919..
 
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5

Effect of (111) Surface Ratio on the Bonding Quality of Cu-..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Jian-Yuan ; Chen, Chih - p. 626-630 , 2024
Link: https://doi.org/10.1109/..
 
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6

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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7

Effects of residual stress and microstructure on extremely ..:

Lin, Huai-En ; Tran, Dinh-Phuc ; Lin, Guan-Han..
Materials Characterization.  211 (2024)  - p. 113891 , 2024
Link: https://doi.org/10.1016/..
 
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8

Risk Factors for Unplanned Early Implantable Port Catheter ..:

Lu, Ming-Shian ; Chen, Chih-Chen ; Chang, Che-Chia..
Cancer Management and Research.  16 (2024)  - p. 445-454 , 2024
Link: https://doi.org/10.2147/..
 
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9

Characterization of Surface Activation on Nanotwinned Coppe..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lee, Rou-Jun ; He, Pin-Syuan ; Chiu, Wei-Lan... - p. 77-78 , 2024
Link: https://doi.org/10.23919..
 
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10

Influence of Sn grain orientation on mean-time-to-failure e..:

Yao, Yifan ; Gusak, A.M. ; Chen, Chih..
Scripta Materialia.  250 (2024)  - p. 116175 , 2024
Link: https://doi.org/10.1016/..
 
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11

Comparison of Organic and Inorganic Dielectric Hybrid Bondi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
He, Pin-Syuan ; Chen, Chih - p. 1998-2002 , 2024
Link: https://doi.org/10.1109/..
 
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12

Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Huai-En ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 816-820 , 2024
Link: https://doi.org/10.1109/..
 
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13

High-strength and high-conductivity nanotwinned Cu lightly ..:

Lee, Kang-Ping ; Chen, Bo-Yan ; Lin, Yi-Quan...
Materials Science and Engineering: A.  891 (2024)  - p. 145990 , 2024
Link: https://doi.org/10.1016/..
 
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14

High Temperature Mechanical Properties of Nano-twinned Copp..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Parween, Gulnaz ; Chen, Bo-Yan ; Tran, Dinh-Phuc.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/..
 
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15

Surface Modification by Wet Treatment for Low-Temperature C..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yu-An ; Ong, Jia-Juen ; Chiu, Wei-Lan.. - p. 115-116 , 2024
Link: https://doi.org/10.23919..
 
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