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Chen, Chuanke
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1

Novel a-IGZO TFT Pixel Driving Circuit Using Hybrid PWM and..:

Li, Shuai ; Wu, Wanming ; Chen, Chuanke...
IEEE Electron Device Letters.  45 (2024)  6 - p. 1024-1027 , 2024
Link: https://doi.org/10.1109/..
 
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2

High-speed, low-voltage, small-pitch and robust OTFT-based ..:

Wu, Wanming ; Geng, Di ; Chen, Chuanke...
Organic Electronics.  124 (2024)  - p. 106939 , 2024
Link: https://doi.org/10.1016/..
 
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3

Ultra-thin silicon oxide tunnel layer passivated contacts f..:

Zhou, Ying ; Zhao, Dongming ; Yu, Xiangrui...
Solar Energy Materials and Solar Cells.  266 (2024)  - p. 112657 , 2024
Link: https://doi.org/10.1016/..
 
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4

17‐2: Characterization of A‐In‐Ga‐Zn‐O Field Effect Transis..:

Gu, Chen ; Zhang, Chunyu ; Chen, Chuanke.
SID Symposium Digest of Technical Papers.  55 (2024)  S1 - p. 145-146 , 2024
Link: https://doi.org/10.1002/..
 
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5

30 Mb/mm2/layer 3D eDRAM Computing-in-Memory with Embedded ..:

, In: 2023 International Electron Devices Meeting (IEDM),
Tang, Wenjun ; Chen, Chuanke ; Liu, Jialong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

First Demonstration of Stacked 2T0C-DRAM Bit-Cell Construct..:

, In: 2023 International Electron Devices Meeting (IEDM),
Chen, Chuanke ; Xiang, Jinjuan ; Duan, Xinlv... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

27‐3: Invited Paper: High‐Performance Sub‐50nm Channel Leng..:

Duan, Xinlv ; Huang, Kailiang ; Feng, Junxiao...
SID Symposium Digest of Technical Papers.  53 (2022)  1 - p. 318-321 , 2022
Link: https://doi.org/10.1002/..
 
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8

Inter-Layer Dielectric Engineering for Monolithic Stacking ..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chen, Chuanke ; Duan, Xinlv ; Yang, Guanhua... - p. 26.5.1-26.5.4 , 2022
Link: https://doi.org/10.1109/..
 
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9

P‐1.8: A New n+‐Formation Process by NH3Plasma Treatment fo..:

Chen, Chuanke ; Duan, Xinlv ; Chen, Qian...
SID Symposium Digest of Technical Papers.  53 (2022)  S1 - p. 594-595 , 2022
Link: https://doi.org/10.1002/..
 
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10

An Advanced Full Adder Based Arithmetic Logic Unit (ALU) Us..:

Ji, Hansai ; Geng, Di ; Chuai, Xichen...
IEEE Transactions on Electron Devices.  69 (2022)  11 - p. 6160-6165 , 2022
Link: https://doi.org/10.1109/..
 
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11

Vertical Channel-All-Around (CAA) IGZO FET under 50 nm CD w..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Huang, Kailiang ; Duan, Xinlv ; Feng, Junxiao... - p. 296-297 , 2022
Link: https://doi.org/10.1109/..
 
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12

Performance degradation of commercial Ga‐doped passivated e..:

Chen, Chuanke ; Wang, He ; Wang, Jianbo..
Progress in Photovoltaics: Research and Applications.  30 (2021)  3 - p. 300-309 , 2021
Link: https://doi.org/10.1002/..
 
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13

Investigating the viability of PERC solar cells fabricated ..:

Chen, Chuanke ; Yang, Hong ; Wang, Jianbo..
Solar Energy Materials and Solar Cells.  227 (2021)  - p. 111134 , 2021
Link: https://doi.org/10.1016/..
 
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14

Effect of binding force between silver paste and silicon on..:

Yang, Hong ; Wang, He ; Chen, Chuanke..
Microelectronics Reliability.  54 (2014)  1 - p. 188-191 , 2014
Link: https://doi.org/10.1016/..
 
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15

Interface modeling between the printed thick-film silver pa..:

Yang, Hong ; Wang, He ; Lei, Xiandao..
International Journal of Numerical Modelling: Electronic Networks, Devices and Fields.  27 (2013)  4 - p. 649-655 , 2013
Link: https://doi.org/10.1002/..
 
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