Chen, Chuantong
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2

Size effect of nickel-based single crystal superalloy revea..:

Long, Xu ; Shen, Ziyi ; Li, Jiao...
Journal of Materials Research and Technology.  29 (2024)  - p. 2437-2447 , 2024
 
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3

Toward defect-less and minimized work-hardening loss implem..:

Kim, Dongjin ; Baek, Seungyeop ; Nishijima, Masahiko...
Materials Science and Engineering: A.  892 (2024)  - p. 146089 , 2024
 
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4

Quantitative Elemental Characterization for Electroless Cu ..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
 
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5

Enhancing thermal-mechanical performance of micron Ag/ZrW2O..:

Xu, Yuxin ; Qiu, Xiaoming ; Wang, Suyu...
Journal of Alloys and Compounds.  996 (2024)  - p. 174874 , 2024
 
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6

Al heat affected zone-less resistance element welded lap jo..:

Baek, Seungyeop ; Kim, Junyeong ; Kwak, Taeyang...
Journal of Materials Research and Technology.  28 (2024)  - p. 3541-3565 , 2024
 
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7

Effect of thermal-mechanical conditions on strength of sila..:

Li, Weihao ; Geng, Peihao ; Ma, Ninshu.
Materials Today Communications.  38 (2024)  - p. 108507 , 2024
 
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9

Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump B..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhang, Zheng ; Suetake, Aiji ; Liu, Ran... - p. 311-312 , 2024
 
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11

Development of Thermal Characteristics Evaluation System fo..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huo, Fupeng ; Chen, Chuantong ; Zhang, Zheng... - p. 47-48 , 2024
 
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14

Temperature and thickness-dependent silver hillock generati..:

Kim, YehRi ; Kim, Seoah ; Zhang, Zheng...
Journal of Alloys and Compounds.  997 (2024)  - p. 174871 , 2024
 
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