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Chen, Daniel Ssu-Han
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1

A Feasibility Study on Underwater 2D Localization Using PZT..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Sarafianou, Mantalena ; Chen, Daniel Ssu-Han ; Sze Wai Choong, David... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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2

Long-Range High-Resolution Imaging With Silicon-on-Nothing ..:

Sarafianou, Mantalena ; Choong, David Sze Wai ; Chen, Daniel Ssu-Han...
IEEE Sensors Journal.  23 (2023)  20 - p. 24254-24263 , 2023
Link: https://doi.org/10.1109/..
 
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3

Determining Damping Loss in Modeling GHz Acoustic Block thr..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Yang, Zaifeng ; Marvin Tan, Xing Haw ; Chen, Daniel Ssu-Han... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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4

Novel Hybrid Simulation Of Large 128 By 128 Pixels Input To..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Juan, Zibo ; Chen, Daniel Ssu-Han ; Teo, Yong Shun... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Novel Simulation Of Ultrasonic Attenuation In Fourier Trans..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Tan, Xing Haw Marvin ; Chen, Daniel Ssu-Han ; Bui, Viet Phuong... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Analysis Of Crosstalk in Binary Weighted Bulk Acoustic Wave..:

, In: 2023 IEEE International Ultrasonics Symposium (IUS),
Chen, Daniel Ssu-Han ; Trivedi, Shyam ; Marvin Tan, Xing Haw... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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7

MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo..:

, In: 2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS),
Trivedi, Shyam ; Yeo, Yi Xuan ; Sarafianou, Mantalena... - p. 1-5 , 2023
Link: https://doi.org/10.1109/..
 
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8

Recent Advances and Challenges of 2D Fourier Transform Comp..:

, In: 2023 IEEE 23rd International Conference on Nanotechnology (NANO),
Chen, Daniel Ssu-Han ; Teo, Yong Shun ; Yeo, Yi Xuan... - p. 1042-1047 , 2023
Link: https://doi.org/10.1109/..
 
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9

Investigation of Void-free Chip-to-Chip Bonding Methods for..:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Yeo, Yi Xuan ; Leong Ching Wai, Eva ; Chen, Daniel Ssu-Han. - p. 869-872 , 2023
Link: https://doi.org/10.1109/..
 
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10

Development of Thick Sc0.2Al0.8N Film for MEMS Application:

, In: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC),
Sharma, Jaibir ; Chen, Daniel Ssu-Han ; Shun Teo, Yong. - p. 864-868 , 2023
Link: https://doi.org/10.1109/..
 
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11

Effect of Tapered Angle on BAW Transducer Performance for U..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Yang, Zaifeng ; Tan, Xing Haw Marvin ; Bui, Viet Phuong... - p. 1-3 , 2022
Link: https://doi.org/10.1109/..
 
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12

A CSM/TFM imaging scheme for Silicon-On-Nothing ScAlN pMUT ..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Sarafianou, Mantalena ; Choong, David Sze Wai ; Goh, Duan Jian.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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13

Trapping of Microbead Spheroids by pMUTs in Microfluidic Ch..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Koh, Yul ; Goh, Duan Jian ; Choong, David Sze Wai... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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14

A Study of Bonding Materials for GHz Ultrasonic Wavefront C..:

, In: 2022 IEEE International Ultrasonics Symposium (IUS),
Chen, Daniel Ssu-Han ; Sarafianou, Mantalena ; Wai, Eva Leong Ching... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

Application of enhanced bioreduction for hexavalent chromiu..:

Lin, Wei-Han ; Chen, Ssu-Ching ; Chien, Chih-Ching...
Environmental Research.  184 (2020)  - p. 109296 , 2020
Link: https://doi.org/10.1016/..
 
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