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Chen, Kuan-Neng
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1

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low-Temperature Area-Selective Metal Passivation Bonding Pl..:

Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Chen, Chi-Yu...
IEEE Electron Device Letters.  45 (2024)  7 - p. 1273-1276 , 2024
Link: https://doi.org/10.1109/..
 
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3

A Review on Hybrid Bonding Interconnection and Its Characte..:

Hsiung, Chien-Kang ; Chen, Kuan-Neng
IEEE Nanotechnology Magazine.  18 (2024)  2 - p. 41-50 , 2024
Link: https://doi.org/10.1109/..
 
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4

Comparison of Different Copper Nitride Passivation Layers F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chiao-Yen ; Hung, Tzu-Heng ; Liu, Ping-Jung. - p. 2157-2162 , 2024
Link: https://doi.org/10.1109/..
 
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5

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by ..:

Huang, Yuan-Chiu ; Lin, Yu-Xian ; Hsiung, Chien-Kang...
IEEE Electron Device Letters.  45 (2024)  3 - p. 452-455 , 2024
Link: https://doi.org/10.1109/..
 
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6

Investigation of Photosensitive Polyimide With Low Coeffici..:

Huang, Yuan-Chiu ; Hu, Han-Wen ; Liu, Yun-Hsi..
IEEE Journal of the Electron Devices Society.  12 (2024)  - p. 96-103 , 2024
Link: https://doi.org/10.1109/..
 
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7

Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy..:

Hsu, Mu-Ping ; Chen, Chih-Han ; Hong, Zhong-Jie...
IEEE Electron Device Letters.  , 2024
Link: https://doi.org/10.1109/..
 
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8

Application of Elevated-Laser-Liquid-Phase-Epitaxy (ELLPE) ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Shih, Bo-Jheng ; Pan, Yu-Ming ; Wang, Chiao-Yen... - p. 2167-2171 , 2024
Link: https://doi.org/10.1109/..
 
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9

Advancements in single-crystal silicon with elevated-laser-..:

Shih, Bo-Jheng ; Pan, Yu-Ming ; Chung, Hao-Tung...
Japanese Journal of Applied Physics.  63 (2024)  4 - p. 04SP30 , 2024
Link: https://doi.org/10.35848..
 
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10

Ultrathin Glass-Based Wafer-Level Integration for Miniaturi..:

Huang, Yu-Ting ; Tsai, Yi-Chieh ; Huang, Yi-Cheng..
IEEE Transactions on Components, Packaging and Manufacturing Technology.  13 (2023)  1 - p. 120-126 , 2023
Link: https://doi.org/10.1109/..
 
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11

Development of low-temperature bonding platform using ultra..:

Hsu, Mu-Ping ; Chen, Chi-Yu ; Chang, Hsin-Chi...
Applied Surface Science.  635 (2023)  - p. 157645 , 2023
Link: https://doi.org/10.1016/..
 
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12

A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Us..:

Hung, Tzu-Heng ; Liu, Ping-Jung ; Wang, Chiao-Yen..
IEEE Journal of the Electron Devices Society.  11 (2023)  - p. 473-479 , 2023
Link: https://doi.org/10.1109/..
 
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13

High-Performance P-Type Germanium Tri-Gate FETs via Green N..:

Chung, Hao-Tung ; Pan, Yu-Ming ; Lin, Nein-Chih...
IEEE Journal of the Electron Devices Society.  11 (2023)  - p. 262-268 , 2023
Link: https://doi.org/10.1109/..
 
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14

TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid B..:

Hung, Tzu-Heng ; Lo, James Yi-Jen ; Kuo, Tzu-Ying...
IEEE Electron Device Letters.  44 (2023)  7 - p. 1176-1179 , 2023
Link: https://doi.org/10.1109/..
 
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15

Single-Crystal Germanium by Elevated-Laser-Liquid-Phase-Epi..:

Chung, Hao-Tung ; Pan, Yu-Ming ; Lin, Nein-Chih...
IEEE Electron Device Letters.  44 (2023)  7 - p. 1036-1039 , 2023
Link: https://doi.org/10.1109/..
 
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