E-LIB Suche - Ergebnisse für: Chen, Wen-Hwa

1

A Layer-Arranged Meshless Method for the Simulation of Addi..:

Lee, Ming-Hsiao ; Chen, Wen-Hwa ; Mao, Ying
Micromachines. 12 (2021) 6 - p. 674 , 2021

Link: https://doi.org/10.3390/..

2

On the Simulation of 3D Printing Process by a Novel Meshles..:

Mao, Ying ; Chen, Wen-Hwa ; Lee, Ming-Hisao
Journal of Mechanics. 36 (2020) 3 - p. 285-294 , 2020

Link: https://doi.org/10.1017/..

3

Theoretical assessment of structural, mechanical, and therm..:

Chen, Wen-Hwa ; Yu, Ching-Feng ; Cheng, Hsien-Chie
Solid State Sciences. 68 (2017) - p. 10-18 , 2017

Link: https://doi.org/10.1016/..

4

Assessing Ink Transfer Performance of Gravure-Offset Fine-..:

Cheng, Hsien-Chie ; Chen, You-Wei ; Chen, Wen-Hwa..
Journal of Electronic Materials. 47 (2017) 3 - p. 1832-1846 , 2017

Link: https://doi.org/10.1007/..

5

Mechanical property assessment of black phosphorene nanotub..:

Chen, Wen-Hwa ; Yu, Ching-Feng ; Chen, I-Chu.
Computational Materials Science. 133 (2017) - p. 35-44 , 2017

Link: https://doi.org/10.1016/..

6

A study of mechanical properties of multi-layered graphene ..:

Yu, Ching-Feng ; Chen, Kun-Ling ; Cheng, Hsien-Chie.
Computational Materials Science. 117 (2016) - p. 127-138 , 2016

Link: https://doi.org/10.1016/..

7

Combined treatments for producing 5-hydroxymethylfurfural (..:

Nguyen, Chi Van ; Lewis, Daniel ; Chen, Wen-Hwa...
Catalysis Today. 278 (2016) - p. 344-349 , 2016

Link: https://doi.org/10.1016/..

8

Heat dissipation assessment of through silicon via (TSV)-ba..:

Cheng, Hsien-Chie ; Huang, Tzu-Chin ; Hwang, Po-Wen.
Microelectronics Reliability. 59 (2016) - p. 84-94 , 2016

Link: https://doi.org/10.1016/..

9

Influence of structural defect on thermal–mechanical proper..:

Chen, Wen-Hwa ; Chen, I-Chu ; Cheng, Hsien-Chie.
Journal of Materials Science. 52 (2016) 6 - p. 3225-3232 , 2016

Link: https://doi.org/10.1007/..

10

The mechanical, thermodynamic, and electronic properties of..:

Chen, Wen-Hwa ; Cheng, Hsien-Chie ; Yu, Ching-Feng
Journal of Alloys and Compounds. 689 (2016) - p. 857-864 , 2016

Link: https://doi.org/10.1016/..

11

An Ab-initio study of structural, elastic, electronic and t..:

Yu, Ching-Feng ; Cheng, Hsien-Chie ; Chen, Wen-Hwa
Materials Chemistry and Physics. 174 (2016) - p. 70-80 , 2016

Link: https://doi.org/10.1016/..

12

Structural, mechanical, thermodynamic and electronic proper..:

Yu, Ching-Feng ; Cheng, Hsien-Chie ; Chen, Wen-Hwa
RSC Advances. 5 (2015) 86 - p. 70609-70618 , 2015

Link: https://doi.org/10.1039/..

13

Bending Characteristics of Foldable Touch Display Panel wit..:

Cheng, Hsien-Chie ; Xu, Wei-Heng ; Chen, Wen-Hwa...
Advances in Materials Science and Engineering. 2015 (2015) - p. 1-16 , 2015

Link: https://doi.org/10.1155/..

14

Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible..:

Cheng, Hsien-Chie ; Huang, Ho-Hsiang ; Chen, Wen-Hwa.
Journal of Electronic Materials. 44 (2015) 4 - p. 1220-1237 , 2015

Link: https://doi.org/10.1007/..

15

First-principles density functional calculations of physica..:

Chen, Wen-Hwa ; Yu, Ching-Feng ; Chiang, Kuo-Ning.
Intermetallics. 62 (2015) - p. 60-68 , 2015

Link: https://doi.org/10.1016/..